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DG419DY+

DG419DY+

Manufacturer No:

DG419DY+

Description:

IC SWITCH SPDT X 1 35OHM 8SOIC

Datasheet:

Datasheet

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DG419DY+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -85dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    250pA
  • Channel Capacitance (CS(off), CD(off))
    8pF, 8pF
  • Charge Injection
    3pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    175ns, 145ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 20V
  • Voltage - Supply, Single (V+)
    10V ~ 30V
  • Channel-to-Channel Matching (ΔRon)
    3Ohm (Max)
  • On-State Resistance (Max)
    35Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S050-VF400 is an integrated circuit chip developed by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of the M2S050-VF400:Advantages: 1. Versatility: The M2S050-VF400 combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The M2S050-VF400 offers advanced security features, such as secure boot, tamper detection, and secure key storage. These features make it suitable for applications that require secure and reliable operation. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The M2S050-VF400 can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. Its FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): The chip can be used in IoT devices for edge computing, data processing, and connectivity. Its low power consumption and security features make it suitable for IoT applications. 3. Aerospace and defense: The M2S050-VF400 can be used in aerospace and defense applications, such as avionics systems, radar processing, and secure communication. Its high performance, security features, and integration capabilities are beneficial in these demanding environments. 4. Medical devices: The chip can be used in medical devices, such as patient monitoring systems, diagnostic equipment, and medical imaging. Its versatility, low power consumption, and security features are advantageous in medical applications. 5. Automotive: The M2S050-VF400 can be used in automotive applications, including advanced driver-assistance systems (ADAS), infotainment systems, and vehicle control units. Its integration, performance, and security features are valuable in the automotive industry.These are just a few examples of the advantages and application scenarios of the M2S050-VF400. The chip's flexibility and capabilities make it suitable for a wide range of industries and applications.
DG419DY+ Relevant information