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ADG413BRUZ

ADG413BRUZ

Manufacturer No:

ADG413BRUZ

Manufacturer:

Analog Devices Inc.

Description:

IC SW SPST-NO/NCX4 35OHM 16TSSOP

Datasheet:

Datasheet

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ADG413BRUZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -85dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    250pA
  • Channel Capacitance (CS(off), CD(off))
    9pF, 9pF
  • Charge Injection
    5pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    175ns, 145ns
  • Voltage - Supply, Dual (V±)
    ±15V
  • Voltage - Supply, Single (V+)
    12V
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    35Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO/NC
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XCZU11EG-2FFVC1156E is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance processing: The XCZU11EG-2FFVC1156E chip combines a quad-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor, along with programmable logic resources. This allows for high-performance processing capabilities, making it suitable for demanding applications.2. Programmable logic: The chip includes programmable logic resources, which can be customized and programmed to implement specific functions or algorithms. This flexibility makes it suitable for a wide range of applications that require hardware acceleration or custom logic implementation.3. Integrated peripherals: The XCZU11EG-2FFVC1156E chip includes a wide range of integrated peripherals, such as USB, Ethernet, PCIe, and DDR memory controllers. This simplifies the design process and reduces the need for additional external components.4. Low power consumption: The chip is designed to optimize power consumption, making it suitable for applications that require low power operation or battery-powered devices.Application scenarios: 1. Embedded systems: The XCZU11EG-2FFVC1156E chip is commonly used in embedded systems that require high-performance processing capabilities, such as industrial automation, robotics, and automotive applications.2. Edge computing: With its combination of processing power and programmable logic, the chip is well-suited for edge computing applications. It can perform real-time processing and analysis of data at the edge of the network, reducing latency and improving overall system performance.3. Video processing and analytics: The chip's high-performance processing capabilities make it suitable for video processing and analytics applications, such as video surveillance, video conferencing, and augmented reality.4. Wireless communication: The XCZU11EG-2FFVC1156E chip can be used in wireless communication systems, such as base stations or software-defined radios, where it can handle signal processing tasks and implement custom communication protocols.Overall, the XCZU11EG-2FFVC1156E chip offers a combination of processing power, programmable logic, and integrated peripherals, making it suitable for a wide range of applications that require high-performance processing and customization capabilities.
ADG413BRUZ Relevant information