ADG1604BRUZ
Manufacturer No:
ADG1604BRUZ
Manufacturer:
Description:
IC SWITCH SP4TX1 1.1OHM 14TSSOP
Datasheet:
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In Stock : 201
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ADG1604BRUZ Specifications
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TypeParameter
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Supplier Device Package14-TSSOP
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Package / Case14-TSSOP (0.173", 4.40mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 125°C (TA)
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Crosstalk-70dB @ 1MHz
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Current - Leakage (IS(off)) (Max)200pA
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Channel Capacitance (CS(off), CD(off))60pF, 270pF
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Charge Injection125pC
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-3db Bandwidth19MHz
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Switch Time (Ton, Toff) (Max)95ns, 173ns
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Voltage - Supply, Dual (V±)±3.3V ~ 8V
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Voltage - Supply, Single (V+)3.3V ~ 16V
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Channel-to-Channel Matching (ΔRon)30mOhm
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On-State Resistance (Max)1.1Ohm
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Number of Circuits1
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Multiplexer/Demultiplexer Circuit4:1
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Switch CircuitSP4T
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PackagingTube
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Product StatusActive
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Series-
The M2S150-1FCG1152I is an integrated circuit chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S150-1FCG1152I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features such as secure boot, tamper detection, and secure key storage. This makes the M2S150-1FCG1152I chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The M2S150-1FCG1152I chip can be used in industrial automation applications such as motor control, robotics, and process control. Its FPGA fabric allows for custom hardware interfaces and real-time control, while the microcontroller subsystem can handle communication protocols and higher-level control tasks. 2. Internet of Things (IoT): With its low power consumption and security features, the chip is suitable for IoT applications such as smart home devices, environmental monitoring, and asset tracking. The FPGA fabric can be used for sensor interfacing and data processing, while the microcontroller subsystem can handle connectivity and data management. 3. Aerospace and defense: The M2S150-1FCG1152I chip's combination of FPGA and microcontroller capabilities makes it suitable for aerospace and defense applications. It can be used for tasks such as radar signal processing, communication systems, and secure data handling. 4. Medical devices: The chip's versatility and security features make it suitable for medical device applications. It can be used in devices such as patient monitoring systems, medical imaging equipment, and diagnostic devices. 5. Automotive: The M2S150-1FCG1152I chip can be used in automotive applications such as advanced driver-assistance systems (ADAS), infotainment systems, and engine control units. Its FPGA fabric allows for customization and adaptation to specific vehicle requirements, while the microcontroller subsystem can handle communication protocols and control algorithms.These are just a few examples of the advantages and application scenarios of the M2S150-1FCG1152I chip. The versatility and integration of this chip make it suitable for a wide range of applications where both hardware customization and software programmability are required.
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