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MAX333AEUP+T

MAX333AEUP+T

Manufacturer No:

MAX333AEUP+T

Description:

IC SWITCH SPDT X 4 45OHM 20TSSOP

Datasheet:

Datasheet

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MAX333AEUP+T Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-TSSOP
  • Package / Case
    20-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -78dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    250pA
  • Channel Capacitance (CS(off), CD(off))
    5pF
  • Charge Injection
    2pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    175ns, 145ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 20V
  • Voltage - Supply, Single (V+)
    10V ~ 30V
  • Channel-to-Channel Matching (ΔRon)
    2Ohm (Max)
  • On-State Resistance (Max)
    45Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The XCZU9EG-L2FFVB1156E is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. These chips combine a high-performance processing system with programmable logic, making them suitable for a wide range of applications. Here are some advantages and application scenarios of the XCZU9EG-L2FFVB1156E:Advantages: 1. High-performance processing: The XCZU9EG-L2FFVB1156E chip features a quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and an ARM Mali-400 MP2 GPU. This combination provides high-performance processing capabilities for demanding applications.2. Programmable logic: The chip also includes programmable logic resources, allowing users to implement custom hardware accelerators or interface with external devices. This flexibility enables the chip to be tailored to specific application requirements.3. Integrated peripherals: The XCZU9EG-L2FFVB1156E chip includes a wide range of integrated peripherals, such as USB, Ethernet, PCIe, and DDR memory controllers. These peripherals simplify system design and reduce the need for additional external components.4. Low power consumption: The chip is designed to optimize power consumption, making it suitable for power-constrained applications.Application scenarios: 1. Embedded systems: The XCZU9EG-L2FFVB1156E chip is commonly used in embedded systems that require high-performance processing and programmable logic capabilities. It can be used in applications such as industrial automation, robotics, and automotive systems.2. Video processing: The integrated GPU in the chip makes it suitable for video processing applications, such as video surveillance, video conferencing, and digital signage.3. Wireless communication: The chip's processing capabilities and integrated peripherals make it suitable for wireless communication applications, such as base stations, small cells, and wireless routers.4. High-performance computing: The XCZU9EG-L2FFVB1156E chip can be used in high-performance computing applications that require both processing power and programmable logic resources. It can accelerate computationally intensive tasks and enable custom hardware acceleration.5. Aerospace and defense: The chip's high-performance processing and programmable logic capabilities make it suitable for aerospace and defense applications, such as radar systems, avionics, and secure communication systems.Overall, the XCZU9EG-L2FFVB1156E chip offers a combination of high-performance processing, programmable logic, and integrated peripherals, making it versatile for a wide range of applications.
MAX333AEUP+T Relevant information