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MAX4553ESE+

MAX4553ESE+

Manufacturer No:

MAX4553ESE+

Description:

IC SW SPST-NO/NCX4 120OHM 16SOIC

Datasheet:

Datasheet

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MAX4553ESE+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -90dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    1nA
  • Channel Capacitance (CS(off), CD(off))
    3.5pF, 3pF
  • Charge Injection
    2pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    110ns, 90ns
  • Voltage - Supply, Dual (V±)
    ±2V ~ 6V
  • Voltage - Supply, Single (V+)
    2V ~ 12V
  • Channel-to-Channel Matching (ΔRon)
    1Ohm
  • On-State Resistance (Max)
    120Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO/NC
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The MPC8560CVT667LB is a highly integrated circuit chip designed by Freescale Semiconductor (now NXP Semiconductors) for networking and communication applications. Some of the advantages and application scenarios of this chip are:1. High Performance: The MPC8560CVT667LB chip is based on the PowerQUICC III architecture, which provides high-performance processing capabilities. It features a PowerPC e500 core running at 667 MHz, making it suitable for demanding networking applications.2. Integrated Networking Features: The chip integrates various networking features, including multiple Gigabit Ethernet ports, PCI interfaces, USB ports, and Serial RapidIO interfaces. These features enable the chip to be used in various networking and communication applications, such as routers, switches, gateways, and network appliances.3. Security Features: The MPC8560CVT667LB chip incorporates security features like a Cryptographic Acceleration Unit (CAU) and a Security Engine (SEC). These features enable secure communication and data encryption, making it suitable for applications that require high levels of security, such as VPN gateways and firewalls.4. Scalability: The chip supports multiple external memory interfaces, including DDR SDRAM, SRAM, and Flash memory. This allows for scalability and flexibility in designing systems with varying memory requirements.5. Power Efficiency: The MPC8560CVT667LB chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern, such as network switches and routers deployed in data centers.6. Industrial Temperature Range: The chip is designed to operate reliably in industrial temperature ranges (-40°C to +105°C), making it suitable for applications in harsh environments, such as industrial automation and automotive systems.Overall, the MPC8560CVT667LB chip offers high performance, integrated networking features, security capabilities, scalability, power efficiency, and reliability in a single package. It is well-suited for a wide range of networking and communication applications, particularly in the industrial and embedded systems domains.
MAX4553ESE+ Relevant information