ADG4612BRUZ

ADG4612BRUZ

Manufacturer No:

ADG4612BRUZ

Manufacturer:

Analog Devices Inc.

Description:

IC SW SPST-NOX4 5.1OHM 16TSSOP

Datasheet:

Datasheet

Delivery:

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ADG4612BRUZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 105°C (TA)
  • Crosstalk
    -74dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    10nA
  • Channel Capacitance (CS(off), CD(off))
    11.5pF, 11.5pF
  • Charge Injection
    292pC
  • -3db Bandwidth
    250MHz
  • Switch Time (Ton, Toff) (Max)
    73ns, 91ns
  • Voltage - Supply, Dual (V±)
    ±3V ~ 5.5V
  • Voltage - Supply, Single (V+)
    3V ~ 12V
  • Channel-to-Channel Matching (ΔRon)
    50mOhm
  • On-State Resistance (Max)
    5.1Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XCZU1EG-2SFVC784E is a specific model of the Xilinx Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) family. This chip combines a processing system (PS) with programmable logic (PL) in a single device, offering several advantages and application scenarios:Advantages: 1. High-performance processing: The chip integrates ARM Cortex-A53 cores, which provide powerful processing capabilities for running operating systems and applications. 2. Programmable logic: The PL section of the chip consists of programmable logic cells, which can be configured to implement custom hardware accelerators, interfaces, or other specialized functions. 3. Heterogeneous processing: The combination of PS and PL allows for the implementation of heterogeneous processing systems, where software and hardware components work together to optimize performance and power efficiency. 4. Flexibility: The programmable nature of the chip enables customization and adaptability, making it suitable for a wide range of applications. 5. Reduced system complexity: By integrating multiple components into a single chip, the XCZU1EG-2SFVC784E simplifies system design, reduces board space, and lowers power consumption.Application scenarios: 1. Embedded systems: The XCZU1EG-2SFVC784E is commonly used in embedded systems that require high-performance processing and customizable hardware acceleration. It can be found in applications such as industrial automation, robotics, and automotive systems. 2. Edge computing: With its processing power and programmable logic, the chip is suitable for edge computing applications, where real-time processing and low latency are crucial. It can be used in edge AI inference, video analytics, and IoT gateways. 3. Software-defined radio (SDR): The XCZU1EG-2SFVC784E's programmable logic can be utilized to implement SDR functionalities, enabling the chip to handle various wireless communication standards and protocols. 4. High-performance computing (HPC): The chip's processing capabilities make it suitable for HPC applications, such as scientific simulations, data analytics, and image processing. 5. Aerospace and defense: The XCZU1EG-2SFVC784E's combination of processing power and programmable logic makes it suitable for aerospace and defense applications, including radar systems, avionics, and secure communications.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and design choices of a particular project.