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ADG738BRUZ

ADG738BRUZ

Manufacturer No:

ADG738BRUZ

Manufacturer:

Analog Devices Inc.

Description:

IC MUX 8:1 4.5OHM 16TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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ADG738BRUZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -75dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    100pA
  • Channel Capacitance (CS(off), CD(off))
    13pF, 85pF
  • Charge Injection
    3pC
  • -3db Bandwidth
    65MHz
  • Switch Time (Ton, Toff) (Max)
    20ns, 10ns (Typ)
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    2.7V ~ 5.5V
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    4.5Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S150-FC1152I is an integrated circuit chip developed by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S150-FC1152I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features such as secure boot, tamper detection, and secure key storage. This makes the M2S150-FC1152I chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling the chip to handle complex tasks and applications.Application scenarios: 1. Industrial automation: The M2S150-FC1152I chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization of interfaces and protocols, while the microcontroller subsystem handles real-time control and processing. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller capabilities, the chip can be used in IoT devices for tasks such as data acquisition, sensor fusion, and edge computing. The security features also make it suitable for secure IoT applications. 3. Aerospace and defense: The M2S150-FC1152I chip's robustness, security features, and high-performance capabilities make it suitable for aerospace and defense applications. It can be used in avionics systems, communication systems, and secure data processing. 4. Medical devices: The chip's low power consumption, integration, and processing capabilities make it suitable for medical devices such as patient monitoring systems, portable diagnostic devices, and medical imaging equipment. 5. Communications: The chip can be used in communication systems for tasks such as protocol conversion, signal processing, and encryption/decryption. Its FPGA fabric allows for customization of communication interfaces and protocols.These are just a few examples of the advantages and application scenarios of the M2S150-FC1152I chip. Its versatility and integration make it suitable for a wide range of applications where both hardware customization and software programmability are required.
ADG738BRUZ Relevant information