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ADG212AKRZ

ADG212AKRZ

Manufacturer No:

ADG212AKRZ

Manufacturer:

Analog Devices Inc.

Description:

IC SW SPST-NOX4 115OHM 16SOIC

Datasheet:

Datasheet

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ADG212AKRZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -80dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    5nA
  • Channel Capacitance (CS(off), CD(off))
    5pF, 5pF
  • Charge Injection
    20pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    600ns, 450ns
  • Voltage - Supply, Dual (V±)
    ±15V
  • Voltage - Supply, Single (V+)
    15V
  • Channel-to-Channel Matching (ΔRon)
    5.75Ohm
  • On-State Resistance (Max)
    115Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XC7Z100-2FFG1156I is a specific model of the Xilinx Zynq-7000 family of integrated circuit (IC) chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance processing: The XC7Z100-2FFG1156I chip combines a dual-core ARM Cortex-A9 processor with programmable logic, providing high-performance processing capabilities. 2. Programmable logic: The chip includes programmable logic resources, allowing users to implement custom hardware accelerators, interfaces, and other functionalities. 3. System integration: The chip integrates processing, memory, and I/O interfaces on a single device, reducing the need for external components and simplifying system design. 4. Low power consumption: The XC7Z100-2FFG1156I chip is designed to be power-efficient, making it suitable for applications with strict power constraints. 5. Flexibility: The programmable nature of the chip allows for easy updates and modifications, making it suitable for applications that require flexibility and adaptability.Application scenarios: 1. Embedded systems: The XC7Z100-2FFG1156I chip is commonly used in embedded systems where both processing power and programmable logic are required. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. High-performance computing: The chip's dual-core ARM Cortex-A9 processor and programmable logic resources make it suitable for high-performance computing applications, including signal processing, image and video processing, and data analytics. 3. Communication systems: The XC7Z100-2FFG1156I chip can be used in communication systems that require both processing capabilities and flexible I/O interfaces. It can be used in applications such as software-defined radios, network switches, and routers. 4. Medical devices: The chip's combination of processing power and programmable logic makes it suitable for medical devices that require real-time processing and custom interfaces. It can be used in applications such as medical imaging, patient monitoring, and diagnostic equipment. 5. Aerospace and defense: The XC7Z100-2FFG1156I chip's high-performance processing and programmable logic resources make it suitable for aerospace and defense applications, including radar systems, avionics, and unmanned aerial vehicles (UAVs).These are just a few examples of the advantages and application scenarios of the XC7Z100-2FFG1156I chip. The actual usage depends on the specific requirements and design considerations of the target application.
ADG212AKRZ Relevant information