MAX333ACUP+T

MAX333ACUP+T

Manufacturer No:

MAX333ACUP+T

Description:

IC SWITCH SPDT X 4 45OHM 20TSSOP

Datasheet:

Datasheet

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MAX333ACUP+T Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-TSSOP
  • Package / Case
    20-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -78dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    250pA
  • Channel Capacitance (CS(off), CD(off))
    5pF
  • Charge Injection
    2pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    175ns, 145ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 20V
  • Voltage - Supply, Single (V+)
    10V ~ 30V
  • Channel-to-Channel Matching (ΔRon)
    2Ohm (Max)
  • On-State Resistance (Max)
    45Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The M2S150TS-FCG1152I is a specific model of integrated circuit (IC) chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this IC chip:Advantages: 1. Versatility: The M2S150TS-FCG1152I is a highly versatile chip that combines an FPGA (Field-Programmable Gate Array) with a microcontroller subsystem. This allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including a 150K logic element FPGA fabric, a 166 MHz ARM Cortex-M3 processor, programmable analog, and digital peripherals. This integration reduces the need for external components, simplifying the overall system design. 3. Security: The SmartFusion2 family of chips, including the M2S150TS-FCG1152I, offers advanced security features such as secure boot, tamper detection, and secure key storage. This makes it suitable for applications that require robust security measures. 4. Low power consumption: The M2S150TS-FCG1152I chip is designed to be power-efficient, making it suitable for battery-powered or energy-constrained applications.Application scenarios: 1. Industrial automation: The M2S150TS-FCG1152I chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. Its FPGA fabric allows for real-time customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller subsystem, the chip is well-suited for IoT applications. It can handle sensor data processing, communication protocols, and security features required in IoT devices. 3. Aerospace and defense: The M2S150TS-FCG1152I chip's security features, low power consumption, and integration make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication devices, and military-grade equipment. 4. Medical devices: The chip's programmability and integration make it suitable for medical devices such as patient monitoring systems, portable diagnostic equipment, and implantable devices. Its security features also ensure data privacy and protection. 5. Communications and networking: The M2S150TS-FCG1152I chip can be used in networking equipment, routers, and switches. Its FPGA fabric allows for customization and optimization of networking protocols, while its microcontroller subsystem handles control and management tasks.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the target system.