ADG1434YCPZ-REEL7

ADG1434YCPZ-REEL7

Manufacturer No:

ADG1434YCPZ-REEL7

Manufacturer:

Analog Devices Inc.

Description:

IC SWITCH SPDTX4 4.7OHM 20LFCSP

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

ADG1434YCPZ-REEL7 Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-LFCSP (4x4)
  • Package / Case
    20-WFQFN Exposed Pad, CSP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -70dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    300pA
  • Channel Capacitance (CS(off), CD(off))
    12pF, 22pF
  • Charge Injection
    -50pC
  • -3db Bandwidth
    200MHz
  • Switch Time (Ton, Toff) (Max)
    170ns, 75ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 16.5V
  • Voltage - Supply, Single (V+)
    5V ~ 16.5V
  • Channel-to-Channel Matching (ΔRon)
    500mOhm
  • On-State Resistance (Max)
    4.7Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The M2S150TS-FC1152 is a specific model of integrated circuit (IC) chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of the M2S150TS-FC1152 IC chip:Advantages: 1. Versatility: The M2S150TS-FC1152 is a highly versatile SoC device that combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family of chips, including the M2S150TS-FC1152, offers advanced security features such as secure boot, tamper detection, and secure key storage. These features make it suitable for applications that require robust security measures. 4. Low power consumption: The M2S150TS-FC1152 chip is designed to be power-efficient, making it suitable for battery-powered or energy-constrained applications. 5. High performance: With a combination of FPGA fabric and ARM Cortex-M3 processor, the chip offers high-performance computing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The M2S150TS-FC1152 chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and real-time data processing. Its FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): The chip's low power consumption, security features, and integration make it suitable for IoT applications. It can be used in smart home devices, wearable technology, and other IoT edge devices. 3. Aerospace and defense: The M2S150TS-FC1152 chip's security features, high performance, and reliability make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication devices, and military-grade equipment. 4. Medical devices: The chip's integration, low power consumption, and real-time processing capabilities make it suitable for medical devices such as patient monitoring systems, portable diagnostic devices, and medical imaging equipment. 5. Communications and networking: The M2S150TS-FC1152 chip can be used in networking equipment, routers, switches, and communication devices that require high-performance processing, customization, and security features.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and use cases of the target system.