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ADG709CRUZ

ADG709CRUZ

Manufacturer No:

ADG709CRUZ

Manufacturer:

Analog Devices Inc.

Description:

IC SWITCH SP4TX2 4.5OHM 16TSSOP

Datasheet:

Datasheet

Delivery:

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ADG709CRUZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -80dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    10pA (Typ)
  • Channel Capacitance (CS(off), CD(off))
    13pF, 42pF
  • Charge Injection
    3pC
  • -3db Bandwidth
    55MHz
  • Switch Time (Ton, Toff) (Max)
    14ns, 8ns (Typ)
  • Voltage - Supply, Dual (V±)
    ±2.5V
  • Voltage - Supply, Single (V+)
    1.8V ~ 5.5V
  • Channel-to-Channel Matching (ΔRon)
    400mOhm
  • On-State Resistance (Max)
    4.5Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    4:1
  • Switch Circuit
    SP4T
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XC7Z030-2FBG676I is a specific model of the Xilinx Zynq-7000 family of integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance processing: The XC7Z030-2FBG676I chip combines a dual-core ARM Cortex-A9 processor with programmable logic, providing high-performance processing capabilities. 2. Programmable logic: The chip includes programmable logic resources, allowing users to implement custom hardware accelerators, interfaces, and other functionalities. 3. Low power consumption: The chip is designed to optimize power consumption, making it suitable for applications with strict power requirements. 4. Integrated peripherals: The XC7Z030-2FBG676I chip includes various integrated peripherals such as USB, Ethernet, UART, SPI, I2C, and GPIO, simplifying system design and reducing external component count. 5. Scalability: The Zynq-7000 family offers different models with varying levels of performance and resources, allowing users to choose the most suitable chip for their application.Application scenarios: 1. Embedded systems: The XC7Z030-2FBG676I chip is commonly used in embedded systems where both high-performance processing and programmable logic are required. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. Software-defined radio (SDR): The chip's programmable logic can be utilized to implement custom radio interfaces and signal processing algorithms, making it suitable for SDR applications. 3. Video processing: The XC7Z030-2FBG676I chip's processing capabilities and integrated peripherals make it suitable for video processing applications such as video surveillance, video analytics, and video streaming. 4. Internet of Things (IoT): The chip's low power consumption and integrated peripherals make it suitable for IoT applications where power efficiency and connectivity are crucial. 5. High-performance computing: The XC7Z030-2FBG676I chip can be used in high-performance computing applications that require both general-purpose processing and custom hardware acceleration.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and design choices of the system being developed.
ADG709CRUZ Relevant information