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ADG1606BCPZ-REEL7

ADG1606BCPZ-REEL7

Manufacturer No:

ADG1606BCPZ-REEL7

Manufacturer:

Analog Devices Inc.

Description:

IC MUX 16:1 5OHM 32LFCSP

Datasheet:

Datasheet

Delivery:

Payment:

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ADG1606BCPZ-REEL7 Specifications

  • Type
    Parameter
  • Supplier Device Package
    32-LFCSP-VQ (5x5)
  • Package / Case
    32-VFQFN Exposed Pad, CSP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -62dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    150pA
  • Channel Capacitance (CS(off), CD(off))
    18pF, 240pF
  • Charge Injection
    33pC
  • -3db Bandwidth
    22MHz
  • Switch Time (Ton, Toff) (Max)
    128ns, 109ns
  • Voltage - Supply, Dual (V±)
    ±3.3V ~ 8V
  • Voltage - Supply, Single (V+)
    3.3V ~ 16V
  • Channel-to-Channel Matching (ΔRon)
    200mOhm
  • On-State Resistance (Max)
    5Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    16:1
  • Switch Circuit
    -
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The M2S150T-FC1152I is an integrated circuit chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S150T-FC1152I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family of chips, including the M2S150T-FC1152I, provides robust security features such as secure boot, tamper detection, and secure key storage. These features make it suitable for applications that require high levels of security. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications.Application scenarios: 1. Industrial automation: The M2S150T-FC1152I chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. Its FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller subsystem, the chip can be used in IoT applications for edge computing, data processing, and connectivity. Its security features also make it suitable for secure IoT deployments. 3. Aerospace and defense: The M2S150T-FC1152I chip's robustness, security features, and low power consumption make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication systems, and military-grade equipment. 4. Medical devices: The chip's integration, low power consumption, and security features make it suitable for medical devices such as patient monitoring systems, portable diagnostic equipment, and implantable devices. 5. Communications: The chip can be used in communication systems for tasks such as protocol conversion, signal processing, and encryption/decryption. Its FPGA fabric allows for customization and adaptation to specific communication standards.These are just a few examples of the advantages and application scenarios of the M2S150T-FC1152I chip. Its versatility and integration make it suitable for a wide range of applications where a combination of FPGA and microcontroller capabilities is required.
ADG1606BCPZ-REEL7 Relevant information