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ADG1607BCPZ-REEL7

ADG1607BCPZ-REEL7

Manufacturer No:

ADG1607BCPZ-REEL7

Manufacturer:

Analog Devices Inc.

Description:

IC MUX DUAL 8:1 5OHM 32LFCSP

Datasheet:

Datasheet

Delivery:

Payment:

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ADG1607BCPZ-REEL7 Specifications

  • Type
    Parameter
  • Supplier Device Package
    32-LFCSP-VQ (5x5)
  • Package / Case
    32-VFQFN Exposed Pad, CSP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -62dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    150pA
  • Channel Capacitance (CS(off), CD(off))
    18pF, 120pF
  • Charge Injection
    33pC
  • -3db Bandwidth
    38MHz
  • Switch Time (Ton, Toff) (Max)
    128ns, 109ns
  • Voltage - Supply, Dual (V±)
    ±3.3V ~ 8V
  • Voltage - Supply, Single (V+)
    3.3V ~ 16V
  • Channel-to-Channel Matching (ΔRon)
    200mOhm
  • On-State Resistance (Max)
    5Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The M2S150T-1FC1152 is a specific model of integrated circuit (IC) chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of the M2S150T-1FC1152 IC chip:Advantages: 1. Versatility: The M2S150T-1FC1152 chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family of chips, including the M2S150T-1FC1152, provides built-in security features such as secure boot, tamper detection, and secure key storage. This makes it suitable for applications that require robust security measures. 4. Low power consumption: The M2S150T-1FC1152 chip is designed to be power-efficient, making it suitable for battery-powered or energy-constrained applications.Application scenarios: 1. Industrial automation: The M2S150T-1FC1152 chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. Its FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller subsystem, the chip can be used in IoT devices for edge computing, data processing, and connectivity. Its security features also make it suitable for secure IoT applications. 3. Aerospace and defense: The M2S150T-1FC1152 chip's ruggedness, low power consumption, and security features make it suitable for aerospace and defense applications. It can be used in avionics systems, military communication devices, and secure data processing. 4. Medical devices: The chip's integration, low power consumption, and security features make it suitable for medical devices such as patient monitoring systems, portable diagnostic devices, and implantable devices. 5. Automotive: The M2S150T-1FC1152 chip can be used in automotive applications for tasks such as advanced driver assistance systems (ADAS), infotainment systems, and vehicle networking. Its FPGA fabric allows for customization and adaptation to specific automotive requirements.These are just a few examples of the advantages and application scenarios of the M2S150T-1FC1152 IC chip. The actual usage depends on the specific requirements and design considerations of the target application.
ADG1607BCPZ-REEL7 Relevant information