ADG1414BCPZ-REEL7

ADG1414BCPZ-REEL7

Manufacturer No:

ADG1414BCPZ-REEL7

Manufacturer:

Analog Devices Inc.

Description:

IC SW SPST-NOX8 11.5OHM 24LFCSP

Datasheet:

Datasheet

Delivery:

Payment:

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ADG1414BCPZ-REEL7 Specifications

  • Type
    Parameter
  • Supplier Device Package
    24-LFCSP (4x4)
  • Package / Case
    24-WFQFN Exposed Pad, CSP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -75dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    150pA
  • Channel Capacitance (CS(off), CD(off))
    8pF
  • Charge Injection
    10pC
  • -3db Bandwidth
    256MHz
  • Switch Time (Ton, Toff) (Max)
    93ns, 35ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 16.5V
  • Voltage - Supply, Single (V+)
    12V
  • Channel-to-Channel Matching (ΔRon)
    550mOhm
  • On-State Resistance (Max)
    11.5Ohm
  • Number of Circuits
    8
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The XCZU2EG-L1UBVA530I is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance processing: The XCZU2EG-L1UBVA530I chip combines a quad-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor, along with programmable logic resources. This allows for high-performance processing capabilities, making it suitable for demanding applications.2. Programmable logic: The chip includes programmable logic resources, which can be used to implement custom hardware accelerators or to interface with external devices. This flexibility enables the chip to be tailored to specific application requirements.3. Integrated peripherals: The XCZU2EG-L1UBVA530I chip includes a wide range of integrated peripherals, such as USB, Ethernet, PCIe, and DDR memory controllers. This simplifies system design and reduces the need for additional external components.4. Low power consumption: The chip is designed to optimize power consumption, making it suitable for power-constrained applications. It includes power management features that allow for dynamic power scaling based on the workload.Application scenarios: 1. Embedded systems: The XCZU2EG-L1UBVA530I chip is commonly used in embedded systems that require a combination of high-performance processing and programmable logic capabilities. It can be used in applications such as industrial automation, robotics, and automotive systems.2. Edge computing: With its powerful processing capabilities, the chip is suitable for edge computing applications where real-time processing and low latency are critical. It can be used in scenarios such as video analytics, machine learning, and real-time control systems.3. Communication systems: The integrated peripherals and programmable logic resources of the chip make it suitable for communication systems. It can be used in applications such as wireless base stations, network switches, and software-defined radios.4. Medical devices: The XCZU2EG-L1UBVA530I chip's combination of processing power and programmable logic can be utilized in medical devices that require real-time processing, signal processing, and connectivity capabilities. It can be used in applications such as medical imaging, patient monitoring, and diagnostic equipment.Overall, the XCZU2EG-L1UBVA530I chip offers a versatile solution for a wide range of applications that require high-performance processing, programmable logic, and integrated peripherals.