ADG1414BCPZ-REEL7
Manufacturer No:
ADG1414BCPZ-REEL7
Manufacturer:
Description:
IC SW SPST-NOX8 11.5OHM 24LFCSP
Datasheet:
Delivery:
Payment:
In Stock : 39384
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ADG1414BCPZ-REEL7 Specifications
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TypeParameter
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Supplier Device Package24-LFCSP (4x4)
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Package / Case24-WFQFN Exposed Pad, CSP
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 125°C (TA)
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Crosstalk-75dB @ 1MHz
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Current - Leakage (IS(off)) (Max)150pA
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Channel Capacitance (CS(off), CD(off))8pF
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Charge Injection10pC
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-3db Bandwidth256MHz
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Switch Time (Ton, Toff) (Max)93ns, 35ns
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Voltage - Supply, Dual (V±)±4.5V ~ 16.5V
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Voltage - Supply, Single (V+)12V
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Channel-to-Channel Matching (ΔRon)550mOhm
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On-State Resistance (Max)11.5Ohm
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Number of Circuits8
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Multiplexer/Demultiplexer Circuit1:1
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Switch CircuitSPST - NO
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusActive
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Series-
The XCZU2EG-L1UBVA530I is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance processing: The XCZU2EG-L1UBVA530I chip combines a quad-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor, along with programmable logic resources. This allows for high-performance processing capabilities, making it suitable for demanding applications.2. Programmable logic: The chip includes programmable logic resources, which can be used to implement custom hardware accelerators or to interface with external devices. This flexibility enables the chip to be tailored to specific application requirements.3. Integrated peripherals: The XCZU2EG-L1UBVA530I chip includes a wide range of integrated peripherals, such as USB, Ethernet, PCIe, and DDR memory controllers. This simplifies system design and reduces the need for additional external components.4. Low power consumption: The chip is designed to optimize power consumption, making it suitable for power-constrained applications. It includes power management features that allow for dynamic power scaling based on the workload.Application scenarios: 1. Embedded systems: The XCZU2EG-L1UBVA530I chip is commonly used in embedded systems that require a combination of high-performance processing and programmable logic capabilities. It can be used in applications such as industrial automation, robotics, and automotive systems.2. Edge computing: With its powerful processing capabilities, the chip is suitable for edge computing applications where real-time processing and low latency are critical. It can be used in scenarios such as video analytics, machine learning, and real-time control systems.3. Communication systems: The integrated peripherals and programmable logic resources of the chip make it suitable for communication systems. It can be used in applications such as wireless base stations, network switches, and software-defined radios.4. Medical devices: The XCZU2EG-L1UBVA530I chip's combination of processing power and programmable logic can be utilized in medical devices that require real-time processing, signal processing, and connectivity capabilities. It can be used in applications such as medical imaging, patient monitoring, and diagnostic equipment.Overall, the XCZU2EG-L1UBVA530I chip offers a versatile solution for a wide range of applications that require high-performance processing, programmable logic, and integrated peripherals.
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