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ADG1413YRUZ-REEL7

ADG1413YRUZ-REEL7

Manufacturer No:

ADG1413YRUZ-REEL7

Manufacturer:

Analog Devices Inc.

Description:

IC SW SPST-NO/NC 1.8OHM 16TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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ADG1413YRUZ-REEL7 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -100dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    550pA
  • Channel Capacitance (CS(off), CD(off))
    23pF, 23pF
  • Charge Injection
    -20pC
  • -3db Bandwidth
    170MHz
  • Switch Time (Ton, Toff) (Max)
    150ns, 120ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 16.5V
  • Voltage - Supply, Single (V+)
    5V ~ 16.5V
  • Channel-to-Channel Matching (ΔRon)
    100mOhm
  • On-State Resistance (Max)
    1.8Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO/NC
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The M2S025-1VFG256 is a specific model of integrated circuit (IC) chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of the M2S025-1VFG256 IC chip:Advantages: 1. Versatility: The M2S025-1VFG256 chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller, memory, and peripherals, into a single device. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features such as secure boot, tamper detection, and secure key storage. This makes the M2S025-1VFG256 chip suitable for applications requiring robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The M2S025-1VFG256 chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller, the chip can be used in IoT devices for edge computing, data processing, and connectivity. Its security features make it suitable for secure IoT applications. 3. Aerospace and defense: The M2S025-1VFG256 chip's robustness, security features, and high-performance capabilities make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication systems, or military-grade equipment. 4. Medical devices: The chip's low power consumption, integration, and processing capabilities make it suitable for medical devices such as patient monitoring systems, portable diagnostic devices, or implantable devices. 5. Communications and networking: The M2S025-1VFG256 chip can be used in networking equipment, routers, switches, or communication protocols that require high-performance processing, customization, and security.These are just a few examples of the advantages and application scenarios of the M2S025-1VFG256 IC chip. The versatility and features of the chip make it applicable to various industries and use cases where a combination of FPGA and microcontroller capabilities is required.
ADG1413YRUZ-REEL7 Relevant information