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ADG5234BCPZ-RL7

ADG5234BCPZ-RL7

Manufacturer No:

ADG5234BCPZ-RL7

Manufacturer:

Analog Devices Inc.

Description:

IC SWITCH SPDTX4 160OHM 20LFCSP

Datasheet:

Datasheet

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ADG5234BCPZ-RL7 Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-LFCSP (4x4)
  • Package / Case
    20-WFQFN Exposed Pad, CSP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -80dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    100pA
  • Channel Capacitance (CS(off), CD(off))
    4.5pF, 10pF
  • Charge Injection
    0.7pC
  • -3db Bandwidth
    370MHz
  • Switch Time (Ton, Toff) (Max)
    200ns, 95ns
  • Voltage - Supply, Dual (V±)
    ±9V ~ 22V
  • Voltage - Supply, Single (V+)
    9V ~ 40V
  • Channel-to-Channel Matching (ΔRon)
    3.5Ohm
  • On-State Resistance (Max)
    160Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The M2S060T-FGG676I is an integrated circuit chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S060T-FGG676I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features such as secure boot, tamper detection, and secure key storage. This makes the M2S060T-FGG676I chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The M2S060T-FGG676I chip can be used in industrial automation applications such as motor control, robotics, and machine vision. Its FPGA fabric allows for custom hardware acceleration, while the microcontroller subsystem can handle real-time control tasks. 2. Internet of Things (IoT): With its low power consumption and security features, the chip is suitable for IoT applications such as smart home devices, sensor networks, and edge computing. It can handle data processing, connectivity, and security functions. 3. Aerospace and defense: The M2S060T-FGG676I chip's combination of FPGA fabric and microcontroller subsystem makes it suitable for aerospace and defense applications. It can be used in avionics systems, communication equipment, and secure data processing. 4. Medical devices: The chip's versatility and security features make it suitable for medical device applications. It can be used in devices such as patient monitors, diagnostic equipment, and implantable devices. 5. Automotive: The M2S060T-FGG676I chip can be used in automotive applications such as advanced driver-assistance systems (ADAS), infotainment systems, and vehicle control units. Its FPGA fabric allows for customization and adaptation to specific automotive requirements.These are just a few examples of the advantages and application scenarios of the M2S060T-FGG676I chip. Its versatility and integration make it suitable for a wide range of applications where both hardware customization and software programmability are required.
ADG5234BCPZ-RL7 Relevant information