ADG706BRUZ-REEL7
Manufacturer No:
ADG706BRUZ-REEL7
Manufacturer:
Description:
IC MUX 16:1 4.5OHM 28TSSOP
Datasheet:
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In Stock : 7384
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ADG706BRUZ-REEL7 Specifications
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TypeParameter
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Supplier Device Package28-TSSOP
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Package / Case28-TSSOP (0.173", 4.40mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Crosstalk-80dB @ 1MHz
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Current - Leakage (IS(off)) (Max)100pA
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Channel Capacitance (CS(off), CD(off))13pF, 180pF
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Charge Injection8pC
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-3db Bandwidth25MHz
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Switch Time (Ton, Toff) (Max)32ns, 16ns (Typ)
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Voltage - Supply, Dual (V±)±2.5V
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Voltage - Supply, Single (V+)1.8V ~ 5.5V
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Channel-to-Channel Matching (ΔRon)-
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On-State Resistance (Max)4.5Ohm
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Number of Circuits1
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Multiplexer/Demultiplexer Circuit16:1
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Switch Circuit-
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusActive
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Series-
The M2S060-FCSG325I is an integrated circuit chip developed by Microsemi Corporation. It is a member of the SmartFusion2 family of devices and offers several advantages and application scenarios:1. High Integration: The M2S060-FCSG325I chip integrates various functionalities into a single device, including a microcontroller, programmable logic, non-volatile flash memory, analog interfaces, and more. This high level of integration saves board space, reduces power consumption, and simplifies system design.2. Programmability: The chip is programmable using industry-standard hardware description languages like VHDL and Verilog. This allows for customization and modification of the chip's functionalities, making it suitable for a wide range of applications.3. Security Features: The M2S060-FCSG325I chip incorporates several security features like secure boot, tamper detection, and encryption capabilities. These features enhance the security of the applications running on the chip, making it suitable for use in secure systems.4. Mixed-Signal Integration: The chip includes analog interfaces such as analog-to-digital converters (ADCs) and digital-to-analog converters (DACs). This makes it suitable for applications that require mixed-signal processing, such as industrial control systems, motor control, and data acquisition.5. Communication Interfaces: The chip supports various communication interfaces, including Ethernet, USB, UART, SPI, and I2C. This enables easy connectivity with other devices and allows for communication with external components or networks.Application Scenarios:1. Industrial Automation: The M2S060-FCSG325I chip can be used in industrial automation systems for tasks like motor control, sensor interfacing, and data processing. Its integrated features and security enhancements make it suitable for demanding industrial environments.2. Internet of Things (IoT): The chip's programmability, mixed-signal capabilities, and communication interfaces make it applicable to IoT applications. It can serve as a central processing unit for IoT devices, facilitating data acquisition, sensor integration, and communication with cloud platforms.3. Embedded Systems: The M2S060-FCSG325I chip can be used in various embedded systems, including medical devices, automotive applications, and consumer electronics. Its compact size, high integration, and security features make it suitable for these applications.4. Control Systems: The chip's ability to integrate digital and analog functions enables its use in control systems, such as robotics, automation, and power management. It can perform complex control algorithms while interacting with various sensors and actuators.5. Secure Systems: The security features of the chip make it attractive for applications that require secure boot, secure firmware updates, or data encryption. It can be used in military, aerospace, or critical infrastructure systems where data confidentiality and system integrity are crucial.Overall, the M2S060-FCSG325I chip's high integration, programmability, mixed-signal capabilities, and security features make it suitable for a wide range of industrial, IoT, embedded, control, and secure system applications.
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