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ADG1413YCPZ-REEL7

ADG1413YCPZ-REEL7

Manufacturer No:

ADG1413YCPZ-REEL7

Manufacturer:

Analog Devices Inc.

Description:

IC SW SPST-NO/NCX4 1.8OHM 16CSP

Datasheet:

Datasheet

Delivery:

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ADG1413YCPZ-REEL7 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-LFCSP-VQ (4x4)
  • Package / Case
    16-VQFN Exposed Pad, CSP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -100dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    550pA
  • Channel Capacitance (CS(off), CD(off))
    23pF, 23pF
  • Charge Injection
    -20pC
  • -3db Bandwidth
    170MHz
  • Switch Time (Ton, Toff) (Max)
    150ns, 120ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 16.5V
  • Voltage - Supply, Single (V+)
    5V ~ 16.5V
  • Channel-to-Channel Matching (ΔRon)
    100mOhm
  • On-State Resistance (Max)
    1.8Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO/NC
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The A2F060M3E-1CS288I is an integrated circuit chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The A2F060M3E-1CS288I chip combines an FPGA (Field-Programmable Gate Array) with a microcontroller subsystem, providing the benefits of both technologies in a single chip. This versatility allows for a wide range of applications. 2. Integration: The chip integrates various components, including a 166 MHz ARM Cortex-M3 processor, programmable logic, flash memory, and peripherals. This integration reduces the need for external components, simplifying the design and reducing the overall system cost. 3. Security: The SmartFusion2 family incorporates security features such as secure boot, tamper detection, and secure key storage. This makes the A2F060M3E-1CS288I suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High reliability: The A2F060M3E-1CS288I chip is built with radiation-hardened technology, making it suitable for applications in harsh environments, such as aerospace or defense.Application scenarios: 1. Industrial automation: The A2F060M3E-1CS288I chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. Its FPGA capabilities allow for customization and adaptation to specific requirements. 2. Internet of Things (IoT): With its integrated microcontroller and FPGA, the chip can be used in IoT devices for data processing, connectivity, and security. It can handle tasks such as data acquisition, edge computing, and communication protocols. 3. Aerospace and defense: The radiation-hardened design of the chip makes it suitable for aerospace and defense applications, including satellite systems, avionics, and secure communication systems. 4. Medical devices: The A2F060M3E-1CS288I chip can be used in medical devices such as patient monitoring systems, diagnostic equipment, or implantable devices. Its low power consumption and security features are beneficial in this domain. 5. Automotive: The chip can be utilized in automotive applications, including advanced driver-assistance systems (ADAS), infotainment systems, or engine control units (ECUs). Its versatility and security features make it suitable for various automotive requirements.It's important to note that the specific application scenarios may vary depending on the requirements and customization of the chip within a particular system.
ADG1413YCPZ-REEL7 Relevant information