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DG408DY+T

DG408DY+T

Manufacturer No:

DG408DY+T

Description:

IC MUX 8:1 100OHM 16SOIC

Datasheet:

Datasheet

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DG408DY+T Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -92dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    3pF, 26pF
  • Charge Injection
    2pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    150ns, 150ns
  • Voltage - Supply, Dual (V±)
    ±5V ~ 20V
  • Voltage - Supply, Single (V+)
    5V ~ 30V
  • Channel-to-Channel Matching (ΔRon)
    1.5Ohm
  • On-State Resistance (Max)
    100Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The 5CSEBA2U23C8N is an integrated circuit chip from Intel's Cyclone V series of field-programmable gate arrays (FPGAs). Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The 5CSEBA2U23C8N chip offers high-speed processing capabilities, making it suitable for applications that require real-time data processing and high-performance computing. 2. Flexibility: Being an FPGA, it provides the flexibility to be reprogrammed and reconfigured even after deployment, allowing for customization and adaptability to changing requirements. 3. Low Power Consumption: The chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern. 4. Integration: It integrates various components like logic elements, memory blocks, and digital signal processing (DSP) blocks, enabling the implementation of complex systems on a single chip. 5. Cost-Effective: FPGAs can be a cost-effective solution compared to custom ASICs (Application-Specific Integrated Circuits) for low to medium volume production runs.Application Scenarios: 1. Embedded Systems: The 5CSEBA2U23C8N chip can be used in embedded systems for applications like industrial automation, robotics, and automotive electronics, where real-time processing and customization are crucial. 2. Communications: It can be utilized in communication systems for tasks like signal processing, protocol conversion, and encryption/decryption. 3. High-Performance Computing: The chip's high-speed processing capabilities make it suitable for applications in areas like scientific computing, data centers, and digital signal processing. 4. Video and Image Processing: The FPGA's parallel processing capabilities can be leveraged for real-time video and image processing tasks, such as video encoding/decoding, image recognition, and computer vision. 5. Internet of Things (IoT): The flexibility and integration of the chip make it suitable for IoT applications, where it can be used for sensor data processing, edge computing, and connectivity.It's important to note that the specific application scenarios may vary depending on the system requirements and the designer's implementation choices.
DG408DY+T Relevant information