ADG1212YCPZ-500RL7
Manufacturer No:
ADG1212YCPZ-500RL7
Manufacturer:
Description:
IC SW SPST-NOX4 190OHM 16LFCSP
Datasheet:
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In Stock : 3256
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ADG1212YCPZ-500RL7 Specifications
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TypeParameter
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Supplier Device Package16-LFCSP (3x3)
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Package / Case16-WFQFN Exposed Pad, CSP
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 125°C (TA)
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Crosstalk-90dB @ 1MHz
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Current - Leakage (IS(off)) (Max)100pA
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Channel Capacitance (CS(off), CD(off))1.1pF, 1.2pF
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Charge Injection-0.3pC
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-3db Bandwidth1GHz
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Switch Time (Ton, Toff) (Max)130ns, 115ns
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Voltage - Supply, Dual (V±)±4.5V ~ 16.5V
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Voltage - Supply, Single (V+)5V ~ 16.5V
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Channel-to-Channel Matching (ΔRon)2.5Ohm
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On-State Resistance (Max)190Ohm
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Number of Circuits4
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Multiplexer/Demultiplexer Circuit1:1
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Switch CircuitSPST - NO
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusActive
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Series-
The XCZU2EG-2SBVA484I is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. These chips combine a high-performance processing system with programmable logic, making them suitable for a wide range of applications. Here are some advantages and application scenarios of the XCZU2EG-2SBVA484I:Advantages: 1. High-performance processing: The XCZU2EG-2SBVA484I chip features a dual-core Arm Cortex-A53 processor and a dual-core Arm Cortex-R5 real-time processor, providing high-performance processing capabilities. 2. Programmable logic: The chip also includes programmable logic resources, allowing users to implement custom hardware accelerators and interfaces, making it highly flexible and adaptable. 3. Integrated peripherals: The XCZU2EG-2SBVA484I chip includes a wide range of integrated peripherals such as USB, Ethernet, PCIe, and DDR memory controllers, reducing the need for additional external components. 4. Low power consumption: The chip is designed to optimize power consumption, making it suitable for power-constrained applications. 5. High-speed interfaces: The XCZU2EG-2SBVA484I chip supports high-speed interfaces like Gigabit Ethernet, USB 3.0, and PCIe Gen2/3, enabling connectivity to external devices and networks.Application scenarios: 1. Embedded systems: The XCZU2EG-2SBVA484I chip is commonly used in embedded systems where a combination of high-performance processing and programmable logic is required. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. Edge computing: With its processing power and programmable logic, the chip is suitable for edge computing applications where real-time processing and AI acceleration are needed. It can be used in scenarios like video analytics, smart surveillance, and autonomous systems. 3. Communication systems: The XCZU2EG-2SBVA484I chip's integrated peripherals and high-speed interfaces make it suitable for communication systems such as routers, switches, and base stations. 4. Medical devices: The chip's processing capabilities and low power consumption make it suitable for medical devices like patient monitoring systems, medical imaging, and diagnostic equipment. 5. Aerospace and defense: The XCZU2EG-2SBVA484I chip's high-performance processing and programmable logic make it suitable for aerospace and defense applications, including radar systems, avionics, and secure communication systems.These are just a few examples of the advantages and application scenarios of the XCZU2EG-2SBVA484I chip. Its versatility and capabilities make it suitable for a wide range of applications across various industries.
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