ADG5413BRUZ-REEL7

ADG5413BRUZ-REEL7

Manufacturer No:

ADG5413BRUZ-REEL7

Manufacturer:

Analog Devices Inc.

Description:

IC SW SPST-NO/NCX4 10OHM 16TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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ADG5413BRUZ-REEL7 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -70dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    250pA
  • Channel Capacitance (CS(off), CD(off))
    17pF, 17pF
  • Charge Injection
    310pC
  • -3db Bandwidth
    160MHz
  • Switch Time (Ton, Toff) (Max)
    187ns, 138ns
  • Voltage - Supply, Dual (V±)
    ±9V ~ 22V
  • Voltage - Supply, Single (V+)
    9V ~ 40V
  • Channel-to-Channel Matching (ΔRon)
    1.5Ohm
  • On-State Resistance (Max)
    10Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO/NC
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The M2S060-FCS325I is an integrated circuit chip developed by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S060-FCS325I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features such as secure boot, tamper detection, and secure key storage. This makes the M2S060-FCS325I chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications.Application scenarios: 1. Industrial automation: The M2S060-FCS325I chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller subsystem, the chip can be used in IoT devices for edge computing, data processing, and connectivity. The security features make it suitable for secure IoT applications. 3. Aerospace and defense: The M2S060-FCS325I chip can be used in aerospace and defense applications that require high reliability, security, and customization. It can be used for tasks such as avionics, communication systems, and secure data processing. 4. Medical devices: The chip's low power consumption, security features, and customization capabilities make it suitable for medical devices such as patient monitoring systems, portable diagnostic devices, and implantable devices.These are just a few examples of the advantages and application scenarios of the M2S060-FCS325I chip. The versatility and integration of this chip make it suitable for a wide range of applications where a combination of FPGA and microcontroller capabilities is required.