ADG5413BRUZ-REEL7
Manufacturer No:
ADG5413BRUZ-REEL7
Manufacturer:
Description:
IC SW SPST-NO/NCX4 10OHM 16TSSOP
Datasheet:
Delivery:
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In Stock : 3960
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ADG5413BRUZ-REEL7 Specifications
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TypeParameter
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Supplier Device Package16-TSSOP
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Package / Case16-TSSOP (0.173", 4.40mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 125°C (TA)
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Crosstalk-70dB @ 1MHz
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Current - Leakage (IS(off)) (Max)250pA
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Channel Capacitance (CS(off), CD(off))17pF, 17pF
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Charge Injection310pC
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-3db Bandwidth160MHz
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Switch Time (Ton, Toff) (Max)187ns, 138ns
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Voltage - Supply, Dual (V±)±9V ~ 22V
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Voltage - Supply, Single (V+)9V ~ 40V
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Channel-to-Channel Matching (ΔRon)1.5Ohm
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On-State Resistance (Max)10Ohm
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Number of Circuits4
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Multiplexer/Demultiplexer Circuit1:1
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Switch CircuitSPST - NO/NC
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusActive
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Series-
The M2S060-FCS325I is an integrated circuit chip developed by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S060-FCS325I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features such as secure boot, tamper detection, and secure key storage. This makes the M2S060-FCS325I chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications.Application scenarios: 1. Industrial automation: The M2S060-FCS325I chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller subsystem, the chip can be used in IoT devices for edge computing, data processing, and connectivity. The security features make it suitable for secure IoT applications. 3. Aerospace and defense: The M2S060-FCS325I chip can be used in aerospace and defense applications that require high reliability, security, and customization. It can be used for tasks such as avionics, communication systems, and secure data processing. 4. Medical devices: The chip's low power consumption, security features, and customization capabilities make it suitable for medical devices such as patient monitoring systems, portable diagnostic devices, and implantable devices.These are just a few examples of the advantages and application scenarios of the M2S060-FCS325I chip. The versatility and integration of this chip make it suitable for a wide range of applications where a combination of FPGA and microcontroller capabilities is required.
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