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ADG1613BRUZ-REEL7

ADG1613BRUZ-REEL7

Manufacturer No:

ADG1613BRUZ-REEL7

Manufacturer:

Analog Devices Inc.

Description:

IC SW SPST-NO/NC 1.1OHM 16TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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ADG1613BRUZ-REEL7 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -110dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    300pA
  • Channel Capacitance (CS(off), CD(off))
    60pF, 60pF
  • Charge Injection
    170pC
  • -3db Bandwidth
    38MHz
  • Switch Time (Ton, Toff) (Max)
    156ns, 87ns
  • Voltage - Supply, Dual (V±)
    ±3.3V ~ 8V
  • Voltage - Supply, Single (V+)
    3.3V ~ 16V
  • Channel-to-Channel Matching (ΔRon)
    30mOhm
  • On-State Resistance (Max)
    1.1Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO/NC
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The XLP432XD1200-21 integrated circuit chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of these chips are:Advantages: 1. Low Power Consumption: The XLP432XD1200-21 chips are designed to operate at low power levels, making them suitable for battery-powered devices and energy-efficient applications. 2. High Performance: These chips provide high processing power and performance, enabling them to handle complex tasks and applications. 3. Integrated Features: The chips come with various integrated features such as analog-to-digital converters (ADCs), digital-to-analog converters (DACs), timers, and communication interfaces, reducing the need for external components and simplifying the overall design. 4. Small Form Factor: The chips are available in compact packages, making them suitable for space-constrained applications and portable devices. 5. Cost-Effective: The integration of multiple features and low power consumption make these chips cost-effective solutions for a wide range of applications.Application Scenarios: 1. Internet of Things (IoT): The low power consumption and integrated features of these chips make them ideal for IoT devices such as smart sensors, wearable devices, and home automation systems. 2. Industrial Automation: The high performance and integrated communication interfaces of these chips make them suitable for industrial automation applications, including control systems, motor drives, and robotics. 3. Consumer Electronics: The compact form factor and low power consumption make these chips suitable for various consumer electronics applications, including smartphones, tablets, and portable media players. 4. Medical Devices: The low power consumption and integrated analog features of these chips make them suitable for medical devices such as patient monitoring systems, portable medical instruments, and implantable devices. 5. Automotive Electronics: The high performance and integrated communication interfaces of these chips make them suitable for automotive applications, including engine control units, infotainment systems, and advanced driver-assistance systems (ADAS).These are just a few examples of the advantages and application scenarios of the XLP432XD1200-21 integrated circuit chips. The actual implementation and suitability of these chips may vary depending on specific requirements and design considerations.
ADG1613BRUZ-REEL7 Relevant information