ADG444BRZ

ADG444BRZ

Manufacturer No:

ADG444BRZ

Manufacturer:

Analog Devices Inc.

Description:

IC SWITCH SPST-NCX4 70OHM 16SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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ADG444BRZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -100dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    4pF, 4pF
  • Charge Injection
    1pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    110ns, 60ns
  • Voltage - Supply, Dual (V±)
    ±15V
  • Voltage - Supply, Single (V+)
    12V
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    70Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NC
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S050-1FG896I is an integrated circuit chip from Microsemi, which belongs to their SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S050-1FG896I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features like secure boot, tamper detection, and bitstream encryption. These features enhance the security of the system and protect against unauthorized access or tampering. 4. Low power consumption: The M2S050-1FG896I chip is designed to be power-efficient, making it suitable for battery-powered or energy-constrained applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The M2S050-1FG896I chip can be used in industrial automation systems for tasks like motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization of I/O interfaces and real-time processing, while the microcontroller subsystem handles higher-level control and communication tasks. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller, the chip is well-suited for IoT applications. It can be used for edge computing, sensor data processing, and connectivity protocols, allowing for intelligent and efficient IoT devices. 3. Aerospace and defense: The M2S050-1FG896I chip's security features make it suitable for aerospace and defense applications. It can be used in secure communication systems, avionics, or military-grade equipment where data integrity and protection are critical. 4. Medical devices: The chip's low power consumption, high performance, and integration make it suitable for medical devices. It can be used in applications like patient monitoring, medical imaging, or portable diagnostic devices. 5. Communications: The M2S050-1FG896I chip can be used in communication systems, such as routers, switches, or network appliances. The FPGA fabric allows for customization of communication protocols, while the microcontroller subsystem handles higher-level processing and management tasks.These are just a few examples, and the versatility of the M2S050-1FG896I chip allows it to be applied in various other domains where a combination of FPGA and microcontroller capabilities is required.