DG411DYZ

DG411DYZ

Manufacturer No:

DG411DYZ

Description:

IC SWITCH SPST-NCX4 35OHM 16SOIC

Datasheet:

Datasheet

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DG411DYZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -85dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    100pA
  • Channel Capacitance (CS(off), CD(off))
    9pF, 9pF
  • Charge Injection
    5pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    175ns, 145ns
  • Voltage - Supply, Dual (V±)
    ±5V ~ 20V
  • Voltage - Supply, Single (V+)
    5V ~ 44V
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    35Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NC
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S150-1FCVG484I is a specific model of integrated circuit (IC) chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of the M2S150-1FCVG484I IC chip:Advantages: 1. Versatility: The M2S150-1FCVG484I is a highly versatile SoC device that combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, into a single device. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family of chips, including the M2S150-1FCVG484I, offers advanced security features such as secure boot, tamper detection, and secure key storage. These features make it suitable for applications that require robust security measures. 4. Low power consumption: The M2S150-1FCVG484I chip is designed to be power-efficient, making it suitable for battery-powered or energy-constrained applications. 5. High performance: With its FPGA fabric and ARM Cortex-M3 processor, the chip offers high-performance computing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The M2S150-1FCVG484I chip can be used in industrial automation applications such as programmable logic controllers (PLCs), motor control systems, and industrial networking. Its FPGA fabric allows for customization of I/O interfaces and real-time control, while the microcontroller subsystem can handle communication protocols and higher-level processing. 2. Aerospace and defense: The chip's security features, high performance, and integration make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication systems, radar systems, and military-grade embedded systems. 3. Internet of Things (IoT): The M2S150-1FCVG484I chip can be utilized in IoT applications that require both hardware flexibility and software programmability. It can serve as a gateway device, sensor node, or edge computing device in IoT networks. 4. Medical devices: The chip's low power consumption, security features, and integration make it suitable for medical devices such as patient monitoring systems, portable diagnostic devices, and medical imaging equipment. 5. Communications: The M2S150-1FCVG484I chip can be used in communication systems, including wired and wireless networks, base stations, and data centers. Its FPGA fabric can be used for protocol processing, while the microcontroller subsystem can handle higher-level networking tasks.These are just a few examples of the advantages and application scenarios of the M2S150-1FCVG484I IC chip. The actual usage depends on the specific requirements and design considerations of the target application.