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ADG702BRTZ-REEL7

ADG702BRTZ-REEL7

Manufacturer No:

ADG702BRTZ-REEL7

Manufacturer:

Analog Devices Inc.

Description:

IC SWITCH SPST-NCX1 3OHM SOT23-6

Datasheet:

Datasheet

Delivery:

Payment:

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ADG702BRTZ-REEL7 Specifications

  • Type
    Parameter
  • Supplier Device Package
    SOT-23-6
  • Package / Case
    SOT-23-6
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    10pA (Typ)
  • Channel Capacitance (CS(off), CD(off))
    17pF, 17pF
  • Charge Injection
    5pC
  • -3db Bandwidth
    200MHz
  • Switch Time (Ton, Toff) (Max)
    12ns, 8ns (Typ)
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.8V ~ 5V
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    3Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NC
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The M2S150T-FCG1152I is an integrated circuit chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S150T-FCG1152I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features such as secure boot, tamper detection, and secure key storage. This makes the M2S150T-FCG1152I chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications.Application scenarios: 1. Industrial automation: The M2S150T-FCG1152I chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller subsystem, the chip can be used in IoT devices for edge computing, data processing, and connectivity. The security features make it suitable for secure IoT applications. 3. Aerospace and defense: The chip's integration, low power consumption, and security features make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication systems, and military-grade equipment. 4. Medical devices: The M2S150T-FCG1152I chip can be used in medical devices such as patient monitoring systems, diagnostic equipment, and medical imaging devices. The FPGA fabric allows for customization and adaptation to specific medical requirements. 5. Communications: The chip can be used in communication systems for tasks such as protocol conversion, signal processing, and encryption. The FPGA fabric allows for flexibility in implementing various communication standards.These are just a few examples of the advantages and application scenarios of the M2S150T-FCG1152I integrated circuit chip. The versatility and integration of this chip make it suitable for a wide range of applications across different industries.
ADG702BRTZ-REEL7 Relevant information