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DG202BDQ-T1-E3

DG202BDQ-T1-E3

Manufacturer No:

DG202BDQ-T1-E3

Manufacturer:

Vishay Siliconix

Description:

IC SW SPST-NOX4 85OHM 16TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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DG202BDQ-T1-E3 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -95dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    5pF, 5pF
  • Charge Injection
    1pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    300ns, 200ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 22V
  • Voltage - Supply, Single (V+)
    4.5V ~ 25V
  • Channel-to-Channel Matching (ΔRon)
    2Ohm
  • On-State Resistance (Max)
    85Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The M2S025T-1FCSG325I is an integrated circuit chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S025T-1FCSG325I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features like secure boot, tamper detection, and secure key storage. This makes the M2S025T-1FCSG325I chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling complex applications to be implemented efficiently.Application scenarios: 1. Industrial automation: The M2S025T-1FCSG325I chip can be used in industrial automation systems for tasks like motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization of interfaces and protocols, while the microcontroller subsystem handles real-time control and communication. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller, the chip can be used in IoT devices that require both hardware flexibility and software programmability. It can handle sensor data processing, communication protocols, and security features required in IoT applications. 3. Aerospace and defense: The chip's security features, low power consumption, and high-performance processing make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication devices, or military-grade embedded systems. 4. Medical devices: The chip's integration, low power consumption, and security features make it suitable for medical devices like patient monitoring systems, portable medical equipment, or implantable devices. The FPGA fabric allows for customization of interfaces and signal processing algorithms, while the microcontroller subsystem handles real-time control and data processing. 5. Communications: The chip can be used in communication systems that require both hardware acceleration and software programmability. It can handle tasks like protocol conversion, encryption/decryption, or signal processing in communication infrastructure equipment.These are just a few examples of the advantages and application scenarios of the M2S025T-1FCSG325I chip. The versatility and integration of this chip make it suitable for a wide range of applications where both hardware customization and software programmability are required.
DG202BDQ-T1-E3 Relevant information