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DG508BEY-T1-E3

DG508BEY-T1-E3

Manufacturer No:

DG508BEY-T1-E3

Manufacturer:

Vishay Siliconix

Description:

IC MUX 8:1 380OHM 16SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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DG508BEY-T1-E3 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -88dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    1nA
  • Channel Capacitance (CS(off), CD(off))
    3pF, 13pF
  • Charge Injection
    2pC
  • -3db Bandwidth
    250MHz
  • Switch Time (Ton, Toff) (Max)
    250ns, 240ns
  • Voltage - Supply, Dual (V±)
    ±5V ~ 20V
  • Voltage - Supply, Single (V+)
    12V ~ 44V
  • Channel-to-Channel Matching (ΔRon)
    10Ohm
  • On-State Resistance (Max)
    380Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The M2S060-1FGG484I is an integrated circuit chip from Microsemi, which belongs to their SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S060-1FGG484I chip combines an FPGA fabric with a hard ARM Cortex-M3 microcontroller subsystem, providing the flexibility of programmable logic along with the processing power of a microcontroller. 2. Integration: It integrates various components like FPGA fabric, microcontroller subsystem, memory, and peripherals on a single chip, reducing the need for external components and simplifying the overall system design. 3. Security: SmartFusion2 devices offer built-in security features like secure boot, tamper detection, and bitstream encryption, making them suitable for applications that require high levels of security. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High reliability: SmartFusion2 devices are known for their high reliability and robustness, making them suitable for applications that require long-term operation in harsh environments.Application scenarios: 1. Industrial automation: The M2S060-1FGG484I chip can be used in industrial automation systems for tasks like motor control, sensor interfacing, and communication protocols. The FPGA fabric can be programmed to implement custom logic for specific industrial applications. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller, the chip can be used in IoT devices for tasks like data processing, sensor fusion, and communication protocols. The security features make it suitable for secure IoT applications. 3. Aerospace and defense: The high reliability and security features of the chip make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication systems, or for implementing custom logic in defense systems. 4. Medical devices: The chip can be used in medical devices like patient monitoring systems, medical imaging equipment, or laboratory instruments. The FPGA fabric can be programmed to implement signal processing algorithms or custom interfaces. 5. Automotive: The chip can be used in automotive applications like advanced driver-assistance systems (ADAS), infotainment systems, or engine control units. The combination of FPGA and microcontroller allows for customization and flexibility in automotive systems.These are just a few examples, and the M2S060-1FGG484I chip can be used in various other applications where the combination of FPGA and microcontroller is beneficial.
DG508BEY-T1-E3 Relevant information