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ADG701BRTZ-REEL7

ADG701BRTZ-REEL7

Manufacturer No:

ADG701BRTZ-REEL7

Manufacturer:

Analog Devices Inc.

Description:

IC SWITCH SPST-NOX1 3OHM SOT23-6

Datasheet:

Datasheet

Delivery:

Payment:

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ADG701BRTZ-REEL7 Specifications

  • Type
    Parameter
  • Supplier Device Package
    SOT-23-6
  • Package / Case
    SOT-23-6
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    10pA (Typ)
  • Channel Capacitance (CS(off), CD(off))
    17pF, 17pF
  • Charge Injection
    5pC
  • -3db Bandwidth
    200MHz
  • Switch Time (Ton, Toff) (Max)
    12ns, 8ns (Typ)
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.8V ~ 5V
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    3Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The XC7Z030-1FBG676C is a specific model of the Xilinx Zynq-7000 family of integrated circuit (IC) chips. Here are some advantages and application scenarios of this chip:Advantages: 1. Programmable System-on-Chip (SoC): The XC7Z030-1FBG676C combines a dual-core ARM Cortex-A9 processor with programmable logic, allowing for flexible hardware and software integration. 2. High Performance: The chip offers high processing power with up to 866 MHz clock frequency and a 28nm process technology, enabling efficient execution of complex tasks. 3. Low Power Consumption: The XC7Z030-1FBG676C is designed to optimize power efficiency, making it suitable for applications with strict power constraints. 4. Rich Peripheral Integration: It includes various peripherals such as USB, Ethernet, UART, SPI, I2C, and GPIO, providing connectivity options for different applications. 5. FPGA Flexibility: The programmable logic section of the chip allows for customization and acceleration of specific algorithms or hardware functions.Application Scenarios: 1. Embedded Systems: The XC7Z030-1FBG676C is commonly used in embedded systems where a combination of processing power and programmable logic is required. It can be used in industrial automation, robotics, automotive, and aerospace applications. 2. High-Performance Computing: The chip's dual-core ARM Cortex-A9 processors make it suitable for applications that require high computational capabilities, such as image and signal processing, machine learning, and data analytics. 3. Communication Systems: With its integrated peripherals and programmable logic, the XC7Z030-1FBG676C can be used in communication systems like routers, switches, and base stations, enabling customization and optimization of networking protocols. 4. Medical Devices: The chip's low power consumption, high performance, and flexibility make it suitable for medical devices like patient monitoring systems, medical imaging, and diagnostic equipment. 5. Internet of Things (IoT): The XC7Z030-1FBG676C can be used in IoT applications where edge computing and real-time processing are required. It enables the integration of sensor data processing, connectivity, and control functions in a single chip.These are just a few examples of the advantages and application scenarios of the XC7Z030-1FBG676C chip. The specific usage depends on the requirements and design considerations of the target application.
ADG701BRTZ-REEL7 Relevant information