MAX4541EKA+T
Manufacturer No:
MAX4541EKA+T
Manufacturer:
Description:
IC SWITCH SPST-NOX2 60OHM SOT23
Datasheet:
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Payment:
In Stock : 18048
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MAX4541EKA+T Specifications
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TypeParameter
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Supplier Device PackageSOT-23-8
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Package / CaseSOT-23-8
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Crosstalk-90dB @ 1MHz
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Current - Leakage (IS(off)) (Max)100pA
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Channel Capacitance (CS(off), CD(off))8pF, 8pF
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Charge Injection1pC
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-3db Bandwidth-
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Switch Time (Ton, Toff) (Max)100ns, 75ns
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Voltage - Supply, Dual (V±)-
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Voltage - Supply, Single (V+)2.7V ~ 12V
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Channel-to-Channel Matching (ΔRon)800mOhm
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On-State Resistance (Max)60Ohm
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Number of Circuits2
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Multiplexer/Demultiplexer Circuit1:1
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Switch CircuitSPST - NO
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusActive
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Series-
The MPC850SRCVR66BU is a specific model of the MPC850 PowerQUICC microprocessor family developed by NXP Semiconductors. This microprocessor chip offers several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the MPC850SRCVR66BU integrated circuit chips are:Advantages: 1. High Performance: The MPC850SRCVR66BU chip is based on the PowerQUICC architecture, which provides high-performance computing capabilities. It has a clock speed of 66 MHz, allowing for fast data processing and execution of complex tasks.2. Integrated Features: The chip integrates various features such as a PowerPC core, memory management unit (MMU), communication interfaces (UART, SPI, I2C), timers, interrupt controllers, and more. This integration reduces the need for additional external components, simplifying the overall system design.3. Low Power Consumption: The MPC850SRCVR66BU chip is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial.4. Industrial Temperature Range: The chip is designed to operate within an extended industrial temperature range, typically from -40°C to +85°C. This makes it suitable for applications in harsh environments where temperature fluctuations are common.Application Scenarios: 1. Embedded Systems: The MPC850SRCVR66BU chip is commonly used in embedded systems that require high-performance computing capabilities. It can be used in applications such as industrial automation, robotics, automotive systems, and aerospace.2. Networking Equipment: The chip's integrated communication interfaces and high-performance computing capabilities make it suitable for networking equipment such as routers, switches, and gateways. It can handle data processing, routing, and network management tasks efficiently.3. Telecommunications: The MPC850SRCVR66BU chip can be used in telecommunications equipment, including base stations, modems, and network switches. Its high-performance computing capabilities and integrated features enable efficient data processing and communication.4. Control Systems: The chip's low power consumption, industrial temperature range, and integrated features make it suitable for control systems in various industries. It can be used in applications such as process control, motor control, and power management systems.Overall, the MPC850SRCVR66BU integrated circuit chips offer high performance, integrated features, low power consumption, and are suitable for a wide range of applications in embedded systems, networking, telecommunications, and control systems.
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