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DG409LEDQ-T1-GE3

DG409LEDQ-T1-GE3

Manufacturer No:

DG409LEDQ-T1-GE3

Manufacturer:

Vishay Siliconix

Description:

IC SWITCH SP4T X 2 23OHM 16TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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DG409LEDQ-T1-GE3 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -109dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    1nA
  • Channel Capacitance (CS(off), CD(off))
    5.5pF, 13.5pF
  • Charge Injection
    -10pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    72ns, 47ns
  • Voltage - Supply, Dual (V±)
    ±3.3V ~ 8V
  • Voltage - Supply, Single (V+)
    3V ~ 16V
  • Channel-to-Channel Matching (ΔRon)
    1Ohm
  • On-State Resistance (Max)
    23Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    4:1
  • Switch Circuit
    SP4T
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The MPC850SRCVR50BU is a specific model of the MPC850 PowerQUICC microprocessor family developed by NXP Semiconductors. This microprocessor chip offers several advantages and can be applied in various scenarios. Here are some of its advantages and application scenarios:Advantages: 1. High Performance: The MPC850SRCVR50BU chip is designed to deliver high-performance computing capabilities, making it suitable for demanding applications. 2. Power Efficiency: It is built with power-efficient architecture, allowing it to optimize power consumption while maintaining performance. 3. Integrated Features: The chip integrates various features such as a PowerPC core, memory management unit, communication interfaces, timers, and interrupt controllers, reducing the need for additional components. 4. Scalability: The MPC850SRCVR50BU chip offers scalability, allowing it to be used in a wide range of applications with varying performance requirements. 5. Industrial-Grade Reliability: It is designed to meet industrial-grade reliability standards, making it suitable for applications that require robust and dependable operation.Application Scenarios: 1. Networking Equipment: The MPC850SRCVR50BU chip can be used in networking equipment such as routers, switches, and gateways. Its high-performance computing capabilities and integrated communication interfaces make it suitable for handling network traffic efficiently. 2. Industrial Automation: With its industrial-grade reliability and power efficiency, the chip can be applied in industrial automation systems. It can control and monitor various processes, communicate with other devices, and handle real-time data processing. 3. Embedded Systems: The MPC850SRCVR50BU chip can be used in embedded systems that require high-performance computing, such as automotive electronics, medical devices, and aerospace applications. Its integrated features and scalability make it suitable for diverse embedded applications. 4. Communication Systems: The chip's integrated communication interfaces, including Ethernet, serial ports, and Universal Serial Bus (USB), make it suitable for communication systems. It can be used in applications like telecommunication switches, base stations, and data communication devices. 5. Control Systems: The MPC850SRCVR50BU chip can be utilized in control systems for various applications, including robotics, process control, and home automation. Its high-performance computing capabilities and integrated features enable precise control and real-time data processing.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and implementation of the MPC850SRCVR50BU chip in a particular system.
DG409LEDQ-T1-GE3 Relevant information