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DG408LEDY-T1-GE3

DG408LEDY-T1-GE3

Manufacturer No:

DG408LEDY-T1-GE3

Manufacturer:

Vishay Siliconix

Description:

IC MUX 8:1 23OHM 16SOIC

Datasheet:

Datasheet

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Payment:

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DG408LEDY-T1-GE3 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -98dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    1nA
  • Channel Capacitance (CS(off), CD(off))
    5.5pF, 25pF
  • Charge Injection
    -11pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    72ns, 47ns
  • Voltage - Supply, Dual (V±)
    ±3V ~ 8V
  • Voltage - Supply, Single (V+)
    3V ~ 16V
  • Channel-to-Channel Matching (ΔRon)
    1Ohm
  • On-State Resistance (Max)
    23Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The MPC850DSLVR50BU is a specific model of the MPC850 PowerQUICC microprocessor family developed by NXP Semiconductors. This integrated circuit chip offers several advantages and can be applied in various scenarios. Some of these advantages and application scenarios include:Advantages: 1. High Performance: The MPC850DSLVR50BU chip is designed to deliver high-performance computing capabilities, making it suitable for demanding applications. 2. Power Efficiency: It is built with power-efficient architecture, allowing it to optimize power consumption while maintaining performance. 3. Integrated Features: The chip integrates various peripherals and interfaces, reducing the need for additional components and simplifying system design. 4. Scalability: The MPC850DSLVR50BU chip offers scalability, allowing it to be used in a wide range of applications with varying performance requirements. 5. Reliability: NXP Semiconductors is a reputable semiconductor manufacturer known for producing reliable and durable chips, ensuring the longevity and stability of the MPC850DSLVR50BU.Application Scenarios: 1. Networking Equipment: The MPC850DSLVR50BU chip is commonly used in networking equipment such as routers, switches, and gateways. Its high-performance computing capabilities and integrated networking features make it suitable for these applications. 2. Industrial Automation: The chip can be applied in industrial automation systems, including programmable logic controllers (PLCs), motor control units, and industrial communication devices. Its power efficiency and reliability are crucial in these scenarios. 3. Embedded Systems: The MPC850DSLVR50BU chip can be used in various embedded systems, including automotive electronics, medical devices, and consumer electronics. Its scalability and integrated features make it adaptable to different embedded applications. 4. Communication Infrastructure: The chip can be utilized in communication infrastructure equipment like base stations, access points, and network switches. Its high-performance computing capabilities and networking features enable efficient data processing and communication. 5. Internet of Things (IoT): With its power efficiency and integrated features, the MPC850DSLVR50BU chip can be employed in IoT devices and edge computing systems. It enables data processing and connectivity in resource-constrained environments.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and implementation of the MPC850DSLVR50BU chip in a particular system.
DG408LEDY-T1-GE3 Relevant information