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DG2730DN-T1-GE4

DG2730DN-T1-GE4

Manufacturer No:

DG2730DN-T1-GE4

Manufacturer:

Vishay Siliconix

Description:

IC SWITCH DPDTX1 8OHM 10MINIQFN

Datasheet:

Datasheet

Delivery:

Payment:

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DG2730DN-T1-GE4 Specifications

  • Type
    Parameter
  • Supplier Device Package
    10-miniQFN (1.4x1.8)
  • Package / Case
    10-UFQFN
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -45dB @ 240MHz
  • Current - Leakage (IS(off)) (Max)
    100nA
  • Channel Capacitance (CS(off), CD(off))
    2.2pF
  • Charge Injection
    0.5pC
  • -3db Bandwidth
    900MHz
  • Switch Time (Ton, Toff) (Max)
    30ns, 25ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    2.7V ~ 4.3V
  • Channel-to-Channel Matching (ΔRon)
    800mOhm
  • On-State Resistance (Max)
    8Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    2:2
  • Switch Circuit
    DPDT
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The MPC850DEZQ50BU is a specific model of the MPC850 PowerQUICC microprocessor integrated circuit chip. Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The MPC850DEZQ50BU chip offers a high-performance PowerQUICC architecture, which combines a PowerPC core with integrated communications peripherals. This allows for efficient processing and handling of complex tasks. 2. Integrated Communications: The chip includes various integrated communications peripherals such as Ethernet, UART, and serial interfaces. This makes it suitable for applications requiring networking and communication capabilities. 3. Low Power Consumption: The MPC850DEZQ50BU chip is designed to be power-efficient, making it suitable for battery-powered devices or applications where power consumption is a concern. 4. Scalability: The chip supports various memory and peripheral options, allowing for scalability and customization based on specific application requirements. 5. Reliability: The MPC850DEZQ50BU chip is known for its reliability and robustness, making it suitable for applications that require high availability and fault tolerance.Application Scenarios: 1. Networking Equipment: The integrated communications peripherals and high-performance architecture of the MPC850DEZQ50BU chip make it suitable for networking equipment such as routers, switches, and gateways. 2. Industrial Automation: The chip's reliability, low power consumption, and communication capabilities make it suitable for industrial automation applications, including control systems, data acquisition, and monitoring devices. 3. Embedded Systems: The MPC850DEZQ50BU chip can be used in various embedded systems, including automotive electronics, medical devices, and consumer electronics, where a combination of processing power and communication capabilities is required. 4. Telecommunications: The chip's integrated communications peripherals and high-performance architecture make it suitable for telecommunications applications, including base stations, network switches, and voice-over-IP (VoIP) systems. 5. Internet of Things (IoT): The MPC850DEZQ50BU chip can be used in IoT devices that require both processing power and connectivity, such as smart home devices, industrial IoT sensors, and edge computing devices.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the target system.
DG2730DN-T1-GE4 Relevant information