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LTC4300A-3CDD#TRPBF

LTC4300A-3CDD#TRPBF

Manufacturer No:

LTC4300A-3CDD#TRPBF

Manufacturer:

Analog Devices Inc.

Description:

IC ACCELERATOR I2C HOTSWAP 8DFN

Datasheet:

Datasheet

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LTC4300A-3CDD#TRPBF Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-DFN (3x3)
  • Package / Case
    8-WFDFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Current - Supply
    3mA
  • Voltage - Supply
    2.7V ~ 5.5V
  • Capacitance - Input
    10 pF
  • Signal Conditioning
    -
  • Delay Time
    -
  • Number of Channels
    2
  • Data Rate (Max)
    400kHz
  • Output
    2-Wire Bus
  • Input
    2-Wire Bus
  • Applications
    I²C - Hotswap
  • Type
    Buffer, Accelerator
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The LTC4300A-3CDD#TRPBF is a specific model of integrated circuit chip designed by Linear Technology (now part of Analog Devices). It is a hot-swappable 2-wire bus buffer that provides bidirectional buffering, voltage level translation, and capacitive isolation between two I2C or SMBus buses. Here are some advantages and application scenarios of this chip:Advantages: 1. Hot-swappability: The LTC4300A-3CDD#TRPBF allows for live insertion and removal of cards or modules on an I2C or SMBus without disrupting the bus communication. This feature is particularly useful in applications where continuous operation is critical, such as in server racks or industrial control systems.2. Bidirectional buffering: The chip acts as a buffer between two I2C or SMBus buses, isolating them from each other. This helps prevent bus contention and data corruption when multiple devices try to communicate simultaneously.3. Voltage level translation: The LTC4300A-3CDD#TRPBF supports voltage level translation between two buses operating at different voltage levels. This allows devices with different voltage requirements to communicate seamlessly on the same bus.4. Capacitive isolation: The chip provides capacitive isolation between the two buses, reducing the impact of bus capacitance and improving signal integrity. This is particularly beneficial in applications with long bus lines or multiple devices connected to the bus.Application scenarios: 1. Multi-board systems: The LTC4300A-3CDD#TRPBF is commonly used in systems with multiple boards or modules communicating over I2C or SMBus. It ensures reliable and robust communication between the boards, even during hot-swapping or when operating at different voltage levels.2. Industrial automation: In industrial control systems, where various sensors, actuators, and controllers communicate over I2C or SMBus, the LTC4300A-3CDD#TRPBF can be used to isolate and buffer the bus signals, preventing data corruption and ensuring smooth operation.3. Server racks and data centers: In large-scale server racks or data centers, where numerous devices are interconnected over I2C or SMBus, the hot-swappability and voltage level translation capabilities of the LTC4300A-3CDD#TRPBF are valuable. They allow for easy maintenance and expansion without interrupting the operation of the entire system.4. Automotive electronics: The chip can also find applications in automotive electronics, where different components and subsystems need to communicate over I2C or SMBus. The hot-swappability and voltage level translation features enable seamless integration and interoperability of various automotive modules.Overall, the LTC4300A-3CDD#TRPBF integrated circuit chip offers advantages in terms of hot-swappability, bidirectional buffering, voltage level translation, and capacitive isolation. Its application scenarios range from multi-board systems and industrial automation to server racks and automotive electronics.
LTC4300A-3CDD#TRPBF Relevant information