FIN1101M
Manufacturer No:
FIN1101M
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FIN1101M Specifications
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TypeParameter
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Supplier Device Package8-SOIC
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Package / Case8-SOIC (0.154", 3.90mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C
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Current - Supply9.3mA
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Voltage - Supply3V ~ 3.6V
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Capacitance - Input2.2 pF
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Signal Conditioning-
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Delay Time1.1ns
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Number of Channels1
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Data Rate (Max)1.6Gbps
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OutputLVDS
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InputLVDS, LVPECL
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ApplicationsLVDS
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TypeBuffer, ReDriver
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PackagingTube
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Product StatusObsolete
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Series-
The FIN1101M integrated circuit chips have several advantages and application scenarios:Advantages: 1. Low power consumption: The FIN1101M chips are designed to operate with low power requirements, making them suitable for battery-powered devices and energy-efficient applications. 2. High integration: These chips integrate multiple functions into a single package, reducing the need for external components and simplifying the overall design. 3. Small form factor: The compact size of the FIN1101M chips makes them suitable for space-constrained applications where size and weight are critical factors. 4. High performance: These chips offer high-speed data transmission and processing capabilities, enabling efficient and reliable operation in demanding applications. 5. Cost-effective: The integration of multiple functions and the availability of these chips in large quantities make them cost-effective for mass production.Application scenarios: 1. Internet of Things (IoT): The FIN1101M chips can be used in IoT devices for wireless communication, sensor data processing, and connectivity with other devices or networks. 2. Wearable devices: These chips can be integrated into wearable devices such as smartwatches, fitness trackers, and healthcare monitoring devices, enabling wireless communication and data processing. 3. Home automation: The FIN1101M chips can be used in smart home systems for controlling and monitoring various devices and appliances, enabling wireless connectivity and data exchange. 4. Industrial automation: These chips can be utilized in industrial automation systems for data acquisition, control, and communication in manufacturing processes, robotics, and monitoring systems. 5. Automotive electronics: The FIN1101M chips can be employed in automotive applications for wireless communication, sensor data processing, and connectivity with other vehicle systems. 6. Consumer electronics: These chips can be used in various consumer electronic devices such as smartphones, tablets, and gaming consoles for wireless connectivity and data processing.Overall, the FIN1101M integrated circuit chips offer advantages of low power consumption, high integration, small form factor, high performance, and cost-effectiveness, making them suitable for a wide range of applications in IoT, wearable devices, home automation, industrial automation, automotive electronics, and consumer electronics.
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