LTC4309IGN#PBF
Manufacturer No:
LTC4309IGN#PBF
Manufacturer:
Description:
IC ACCELERATR I2C HOTSWAP 16SSOP
Datasheet:
Delivery:
Payment:
In Stock : 85
Please send RFQ , we will respond immediately.
LTC4309IGN#PBF Specifications
-
TypeParameter
-
Supplier Device Package16-SSOP
-
Package / Case16-SSOP (0.154", 3.90mm Width)
-
Mounting TypeSurface Mount
-
Operating Temperature-40°C ~ 85°C
-
Current - Supply7mA
-
Voltage - Supply2.3V ~ 5.5V
-
Capacitance - Input10 pF
-
Signal Conditioning-
-
Delay Time-
-
Number of Channels2
-
Data Rate (Max)400kHz
-
Output2-Wire Bus
-
Input2-Wire Bus
-
ApplicationsI²C - Hotswap
-
TypeBuffer, Accelerator
-
PackagingTube
-
Product StatusActive
-
Series-
The LTC4309IGN#PBF is a hot-swappable 2-wire bus buffer with a built-in overvoltage protection feature. Here are some advantages and application scenarios of this integrated circuit chip:Advantages: 1. Hot-Swappability: The LTC4309IGN#PBF allows for live insertion and removal of devices on a 2-wire bus without disrupting the communication or causing damage to the devices. This feature is particularly useful in applications where continuous operation is critical, such as industrial control systems or data centers.2. Overvoltage Protection: The integrated overvoltage protection feature safeguards the connected devices from voltage spikes or transients that can occur during hot-swapping or due to external factors. This protection helps prevent damage to sensitive components and ensures the reliability of the system.3. Low Voltage Operation: The LTC4309IGN#PBF supports low voltage operation, making it suitable for applications that require communication between devices operating at different voltage levels. It allows for bidirectional voltage level translation between two different voltage domains, enabling seamless integration of devices with varying voltage requirements.4. I2C and SMBus Compatible: The chip is compatible with the popular I2C and SMBus protocols, making it versatile and widely applicable in various industries and applications.Application Scenarios: 1. Server and Data Center Systems: The LTC4309IGN#PBF can be used in server and data center systems to enable hot-swapping of components such as hard drives, power supplies, or expansion cards without interrupting the operation of the system.2. Industrial Control Systems: In industrial automation and control systems, the chip can be used to facilitate hot-swapping of modules or devices, allowing for easy maintenance or replacement without shutting down the entire system.3. Communication Equipment: The LTC4309IGN#PBF can be employed in communication equipment, such as routers or switches, to enable hot-swapping of line cards or interface modules, ensuring uninterrupted network connectivity.4. Consumer Electronics: The chip can be utilized in consumer electronics devices that utilize the I2C or SMBus protocols, enabling hot-swapping of peripherals or expansion modules without disrupting the operation of the main device.Overall, the LTC4309IGN#PBF offers hot-swappability, overvoltage protection, and voltage level translation capabilities, making it suitable for a wide range of applications where seamless device insertion and removal, protection against voltage spikes, and compatibility with I2C/SMBus protocols are required.
LTC4309IGN#PBF Relevant information
-
PCA9510AD,118
National Semiconductor -
PCA9511ADP,118
National Semiconductor -
PTN3944EWY
ams-OSRAM USA INC. -
MC14504BDTG
Infineon Technologies -
PCA9507D,112
Fairchild Semiconductor -
PCA9517AD,118
National Semiconductor -
PCA9513AD,118
National Semiconductor -
LTC4307CMS8#PBF
Rochester Electronics, LLC -
MAX3772CEE-T
Nexperia USA Inc. -
DS90LV001TM/NOPB
National Semiconductor