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CYV15G0204TRB-BGC

CYV15G0204TRB-BGC

Manufacturer No:

CYV15G0204TRB-BGC

Manufacturer:

Infineon Technologies

Description:

IC SERDES HOTLINK 256LBGA

Datasheet:

Datasheet

Delivery:

Payment:

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CYV15G0204TRB-BGC Specifications

  • Type
    Parameter
  • Supplier Device Package
    256-L2BGA (27x27)
  • Package / Case
    256-BGA Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    3.3V
  • Number of Outputs
    4/20
  • Number of Inputs
    20/4
  • Output Type
    PECL
  • Input Type
    LVTTL
  • Data Rate
    1.485Gbps
  • Function
    Serializer/Deserializer
  • Packaging
    Tray
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The CYV15G0204TRB-BGC integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-speed performance: These chips are designed for high-speed data transmission, making them suitable for applications that require fast and reliable communication. 2. Low power consumption: The chips are optimized for low power consumption, making them ideal for battery-powered devices or applications where power efficiency is crucial. 3. Small form factor: The chips are compact and come in a small package, making them suitable for space-constrained applications. 4. Wide operating voltage range: The chips can operate within a wide voltage range, providing flexibility in various applications. 5. Robustness and reliability: The chips are designed to be highly reliable and can withstand harsh operating conditions, ensuring long-term performance.Application scenarios: 1. High-speed data communication: The chips can be used in applications such as high-speed networking, data centers, and telecommunications, where fast and reliable data transmission is required. 2. Internet of Things (IoT): The chips can be used in IoT devices that require wireless connectivity, such as smart home devices, wearables, and industrial sensors. 3. Automotive electronics: The chips can be used in automotive applications, including advanced driver-assistance systems (ADAS), infotainment systems, and vehicle-to-vehicle communication. 4. Industrial automation: The chips can be used in industrial automation systems, including robotics, machine vision, and control systems, where high-speed communication and low power consumption are essential. 5. Medical devices: The chips can be used in medical devices that require wireless connectivity, such as patient monitoring systems, remote diagnostics, and telemedicine applications.Overall, the CYV15G0204TRB-BGC integrated circuit chips offer high-speed performance, low power consumption, and reliability, making them suitable for a wide range of applications in various industries.
CYV15G0204TRB-BGC Relevant information