THC63LVD1027-B
Manufacturer No:
THC63LVD1027-B
Manufacturer:
Description:
IC SER/DESER DUAL LVDS 64TSSOP
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THC63LVD1027-B Specifications
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TypeParameter
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Supplier Device Package64-TSSOP
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Package / Case64-TFSOP (0.240", 6.10mm Width) Exposed Pad
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Voltage - Supply3V ~ 3.6V
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Number of Outputs30
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Number of Inputs30
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Output TypeLVDS
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Input TypeLVDS
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Data Rate-
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FunctionSerializer/Deserializer
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PackagingTray
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Product StatusActive
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SeriesTHine®
The THC63LVD1027-B is an integrated circuit (IC) chip designed for high-speed, low-voltage differential signaling (LVDS) applications. Here are some of its advantages and application scenarios:1. High-Speed Data Transmission: The THC63LVD1027-B supports data rates up to 1.5 Gbps, making it ideal for high-speed data transmission applications, such as video streaming, imaging, and communications.2. Low Voltage Differential Signaling: LVDS technology provides robust noise immunity and reduces power consumption compared to single-ended signaling. The chip operates at lower voltages, enhancing energy efficiency in portable devices.3. EMI Reduction: The IC chip features built-in electromagnetic interference (EMI) reduction techniques, mitigating interference generated during data transmission. This makes it suitable for applications sensitive to EMI, such as medical devices and automotive systems.4. Long-Range Signaling: The THC63LVD1027-B supports long-range signaling due to its LVDS differential signaling, which enables reliable communication over extended distances. This capability is valuable in industrial automation, surveillance, and wire communication systems.5. Multiple Application Scenarios: The IC chip can be utilized in various scenarios, including display interfaces for LCD panels, TFT screens, LED panels, and projectors. It can also be used in high-speed data transfer systems like PCIe, SATA, and USB.6. Easy Integration: With its compact package, the THC63LVD1027-B is easy to integrate into circuit board designs, making it suitable for space-constrained applications like smartphones, tablets, and small form factor devices.7. High Reliability: This chip offers a high level of reliability, ensuring stable and consistent data transmission across various temperature and environmental conditions. It is well-suited for industrial automation, aerospace, and automotive sectors.Overall, the advantages and application scenarios of the THC63LVD1027-B IC chip revolve around high-speed, low-power LVDS data transmission, long-range signaling, EMI reduction, versatility in display and data transfer applications, ease of integration, and reliability across different industries.
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