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ZSSC4162BE1C

ZSSC4162BE1C

Manufacturer No:

ZSSC4162BE1C

Description:

DICE (WAFER SAWN) - FRAME

Datasheet:

Datasheet

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ZSSC4162BE1C Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Mounting Type
    -
  • Operating Temperature
    -
  • Current - Supply
    -
  • Output Type
    -
  • Input Type
    -
  • Type
    -
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    *
The ZSSC4162BE1C integrated circuit chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of these chips are:1. High Accuracy: The ZSSC4162BE1C chips provide high accuracy in measuring and converting analog signals. They have a high-resolution analog-to-digital converter (ADC) and a digital signal processor (DSP) that ensure precise measurements.2. Sensor Signal Conditioning: These chips are specifically designed for sensor signal conditioning applications. They can interface with various types of sensors, such as pressure sensors, temperature sensors, and strain gauges, and provide accurate and reliable signal conditioning.3. Digital Calibration: The ZSSC4162BE1C chips have built-in digital calibration capabilities. This allows for easy and accurate calibration of the connected sensors, eliminating the need for external calibration components.4. Low Power Consumption: These chips are designed to operate with low power consumption, making them suitable for battery-powered applications. They have a low standby current and can be put into sleep mode when not in use, further reducing power consumption.5. Industrial and Automotive Applications: The ZSSC4162BE1C chips are commonly used in industrial and automotive applications. They can be used in pressure monitoring systems, temperature control systems, level sensing applications, and other industrial and automotive sensor-based systems.6. Communication Interfaces: These chips support various communication interfaces, such as I2C and SPI, which allow for easy integration with microcontrollers and other digital systems. This enables seamless data transfer and control between the chip and the external devices.7. Compact Size: The ZSSC4162BE1C chips are available in small package sizes, making them suitable for space-constrained applications. They can be easily integrated into compact sensor modules or embedded systems.Overall, the ZSSC4162BE1C integrated circuit chips offer high accuracy, digital calibration, low power consumption, and are suitable for a wide range of industrial and automotive sensor-based applications.
ZSSC4162BE1C Relevant information