ZSSC3170EA1D
Manufacturer No:
ZSSC3170EA1D
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DICE (WAFER SAWN) - WAFFLE PACK
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ZSSC3170EA1D Specifications
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Current - Supply-
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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The ZSSC3170EA1D integrated circuit chip offers several advantages and can be applied in various scenarios. Here are some of its key advantages and application scenarios:Advantages: 1. High Accuracy: The ZSSC3170EA1D chip provides high-precision measurements, making it suitable for applications that require precise sensing and measurement.2. Digital Interface: It features a digital interface, allowing for easy integration with microcontrollers and other digital systems. This simplifies the design and implementation process.3. Low Power Consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial.4. Temperature Compensation: The ZSSC3170EA1D chip incorporates temperature compensation techniques, ensuring accurate measurements even in varying temperature conditions.Application Scenarios: 1. Pressure Sensing: The ZSSC3170EA1D chip can be used in pressure sensing applications, such as industrial pressure monitoring, automotive tire pressure monitoring systems, and medical devices.2. Force Sensing: It can be applied in force sensing applications, such as load cells, weighing scales, and robotics, where accurate force measurements are required.3. Level Sensing: The chip can be utilized in level sensing applications, such as liquid level monitoring in tanks, fuel level sensing in vehicles, and water level detection in appliances.4. Industrial Automation: The ZSSC3170EA1D chip can be integrated into industrial automation systems for precise measurement and control of various parameters, such as pressure, force, or level.5. Internet of Things (IoT): With its low power consumption and digital interface, the chip can be used in IoT devices for remote sensing and monitoring applications.It's important to note that the specific application and implementation of the ZSSC3170EA1D chip may vary depending on the requirements and design considerations of the project.