ZSSC3154BE1D

ZSSC3154BE1D

Manufacturer No:

ZSSC3154BE1D

Description:

DICE (WAFER SAWN) - WAFFLE PACK

Datasheet:

Datasheet

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ZSSC3154BE1D Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Mounting Type
    -
  • Operating Temperature
    -
  • Current - Supply
    -
  • Output Type
    -
  • Input Type
    -
  • Type
    -
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    *
The ZSSC3154BE1D is a highly integrated circuit chip designed for sensor signal conditioning and calibration. Some of its advantages and application scenarios include:1. High Accuracy: The ZSSC3154BE1D offers high accuracy in signal conditioning and calibration, making it suitable for precision measurement applications.2. Digital Calibration: It provides digital calibration capabilities, allowing for easy and accurate calibration of sensors without the need for external components.3. Low Power Consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered applications or devices with limited power budgets.4. Small Form Factor: The ZSSC3154BE1D is available in a compact package, making it suitable for space-constrained applications where size is a critical factor.5. Wide Range of Sensor Compatibility: It supports a wide range of sensor types, including resistive, capacitive, and inductive sensors, making it versatile for various sensing applications.6. Industrial and Automotive Applications: The chip is commonly used in industrial and automotive applications, such as pressure sensors, temperature sensors, and position sensors.7. IoT and Wearable Devices: With its low power consumption and small form factor, the ZSSC3154BE1D is also suitable for IoT devices and wearable technology, where size, power efficiency, and accurate sensor measurements are crucial.Overall, the ZSSC3154BE1D integrated circuit chip offers high accuracy, digital calibration, low power consumption, and compatibility with various sensors, making it suitable for a wide range of applications in industries such as automotive, industrial, IoT, and wearable devices.