ZSSC3135BA1C
Manufacturer No:
ZSSC3135BA1C
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DICE (WAFER SAWN) - FRAME
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ZSSC3135BA1C Specifications
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TypeParameter
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Supplier Device Package-
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Package / Case-
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Current - Supply-
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Type-
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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Series*
The ZSSC3135BA1C integrated circuit (IC) chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of ZSSC3135BA1C IC chips are:1. High Accuracy: The ZSSC3135BA1C IC chips provide high accuracy in measuring and converting analog signals. They have a maximum non-linearity error of ±0.1% and a maximum offset error of ±0.5 mV, ensuring precise measurements.2. Low Power Consumption: These IC chips are designed to operate with low power consumption, making them suitable for battery-powered applications. They have a typical current consumption of 0.5 mA, which helps in extending the battery life of devices.3. Digital Interface: The ZSSC3135BA1C IC chips feature a digital interface (I2C or SPI) that allows easy integration with microcontrollers or other digital systems. This enables seamless communication and control between the IC chip and the host system.4. Temperature Compensation: These IC chips come with built-in temperature compensation capabilities, which ensure accurate measurements even in varying temperature conditions. This makes them suitable for applications where temperature changes can affect the measurement accuracy.5. Pressure and Force Sensing: The ZSSC3135BA1C IC chips are primarily designed for pressure and force sensing applications. They can be used in various scenarios such as industrial automation, automotive systems, medical devices, consumer electronics, and more.6. Sensor Signal Conditioning: These IC chips provide signal conditioning functionalities, including amplification, filtering, and calibration, which help in improving the accuracy and reliability of sensor measurements. They can be used with various types of sensors, such as pressure sensors, strain gauges, load cells, and more.7. Compact Size: The ZSSC3135BA1C IC chips are available in small package sizes, making them suitable for space-constrained applications. Their compact size allows for easy integration into devices with limited space.Overall, the ZSSC3135BA1C IC chips offer high accuracy, low power consumption, digital interface, temperature compensation, and are ideal for pressure and force sensing applications in various industries.