MC33793D
Manufacturer No:
MC33793D
Manufacturer:
Description:
IC DSI SLAVE FOR R-SENSE 16-SOIC
Datasheet:
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MC33793D Specifications
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TypeParameter
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Supplier Device Package16-SOIC
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Package / Case16-SOIC (0.154", 3.90mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 150°C
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Current - Supply-
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Output TypeLogic
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Input TypeLogic
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TypeDistributed Systems Interface
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DigiKey ProgrammableNot Verified
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PackagingTube
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Product StatusObsolete
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Series-
The MC33793D is a highly integrated circuit chip designed for automotive applications. Some of its advantages and application scenarios include:1. High integration: The MC33793D integrates multiple functions into a single chip, reducing the need for external components and saving space on the PCB.2. Robustness: The chip is designed to withstand harsh automotive environments, including wide temperature ranges, voltage fluctuations, and electromagnetic interference.3. Power management: The MC33793D includes power management features such as voltage regulators, power switches, and battery monitoring, making it suitable for applications that require efficient power management.4. Communication interfaces: The chip supports various communication interfaces like LIN (Local Interconnect Network) and SPI (Serial Peripheral Interface), enabling easy integration with other automotive systems.5. Automotive applications: The MC33793D is commonly used in automotive applications such as body control modules, lighting systems, HVAC (Heating, Ventilation, and Air Conditioning) systems, and power distribution units.6. Cost-effective solution: The integration of multiple functions into a single chip reduces the overall system cost by eliminating the need for additional components and simplifying the design process.7. Reliability: The MC33793D is designed to meet automotive industry standards for reliability and durability, ensuring long-term operation in demanding automotive environments.Overall, the MC33793D integrated circuit chip offers a cost-effective and reliable solution for various automotive applications, providing high integration, robustness, and power management capabilities.