ZSC31050FID

ZSC31050FID

Manufacturer No:

ZSC31050FID

Description:

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Datasheet:

Datasheet

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ZSC31050FID Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Mounting Type
    -
  • Operating Temperature
    -
  • Current - Supply
    -
  • Output Type
    -
  • Input Type
    -
  • Type
    -
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    *
The ZSC31050FID is an integrated circuit (IC) chip that belongs to the ZSC310 family of chips. These chips are piezo-resistive CMOS sensor signal conditioner ICs. The ZSC31050FID chip provides many advantages and can be used in various application scenarios, including:1. Sensing and control applications: The chip is designed to accurately amplify and condition the signals from piezo-resistive pressure sensors. It enables precise measurement and control of pressure in various systems, such as HVAC (Heating, Ventilation, and Air Conditioning), industrial automation, and medical devices.2. Low power consumption: The ZSC31050FID chip is specifically designed to minimize energy consumption, making it suitable for battery-powered devices. It allows for efficient power management and extends the battery life of portable devices.3. High accuracy and linearity: The chip utilizes advanced calibration techniques to ensure high accuracy and linearity in pressure sensing applications. It provides precise and reliable measurement outputs, contributing to the overall system accuracy.4. Easy integration: The ZSC31050FID chip is highly integrated, featuring an on-chip temperature sensor and a 16-bit analog-to-digital converter (ADC). This integration simplifies the design process and reduces the overall component count in the system.5. Digital output and communication: The chip provides a digital output of the processed sensor signals, making it easy to interface with microcontrollers or other digital systems. It supports I2C communication protocol, enabling seamless integration with digital communication interfaces.6. Compact and rugged package: The ZSC31050FID chip is available in a small form factor package, making it suitable for space-constrained applications. Additionally, it is designed to operate reliably in harsh environmental conditions, making it suitable for industrial and automotive applications.Overall, the advantages and application scenarios of ZSC31050FID integrated circuit chips revolve around their accurate, low-power, and easy-to-integrate nature. These chips are commonly used in pressure sensing and control applications that require high accuracy, energy efficiency, and compact form factors.