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MC33790HEGR2

MC33790HEGR2

Manufacturer No:

MC33790HEGR2

Manufacturer:

NXP Semiconductors

Description:

IC DIST SYST INTERFACE 16SOIC

Datasheet:

Datasheet

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MC33790HEGR2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    1 mA
  • Output Type
    Logic
  • Input Type
    Logic
  • Type
    Distributed Systems Interface
  • DigiKey Programmable
    Not Verified
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    -
The MC33790HEGR2 is an integrated circuit chip that offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of this chip are:Advantages: 1. High integration: The MC33790HEGR2 integrates multiple functions into a single chip, reducing the need for external components and simplifying the design process. 2. Low power consumption: This chip is designed to operate with low power consumption, making it suitable for battery-powered applications. 3. Robust protection features: It includes various protection features such as overvoltage protection, overcurrent protection, and thermal shutdown, ensuring the safety and reliability of the system. 4. Wide operating voltage range: The chip can operate within a wide voltage range, making it suitable for different power supply configurations. 5. Communication interface: It supports various communication interfaces such as SPI and I2C, enabling easy integration with microcontrollers and other devices.Application Scenarios: 1. Automotive electronics: The MC33790HEGR2 is commonly used in automotive applications such as body control modules, lighting systems, and power distribution units. Its robust protection features and wide operating voltage range make it suitable for the harsh automotive environment. 2. Industrial automation: This chip can be used in industrial automation systems for motor control, power management, and communication interfaces. Its low power consumption and high integration make it suitable for compact and energy-efficient industrial devices. 3. Consumer electronics: The MC33790HEGR2 can be applied in various consumer electronics devices such as home appliances, smart meters, and portable devices. Its low power consumption and communication interfaces make it suitable for IoT (Internet of Things) applications. 4. Power management: The chip can be used in power management systems to regulate and control the power supply, ensuring efficient and reliable operation of the system. 5. Renewable energy systems: It can be applied in renewable energy systems such as solar power inverters and wind turbine control systems. Its protection features and wide operating voltage range make it suitable for these applications.Overall, the MC33790HEGR2 integrated circuit chip offers advantages such as high integration, low power consumption, and robust protection features, making it suitable for a wide range of applications in automotive, industrial, consumer electronics, power management, and renewable energy systems.
MC33790HEGR2 Relevant information