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MCZ33784EFR2

MCZ33784EFR2

Manufacturer No:

MCZ33784EFR2

Manufacturer:

NXP USA Inc.

Description:

IC SENSOR DBUS DSI 2.02 16-SOIC

Datasheet:

Datasheet

Delivery:

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MCZ33784EFR2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Current - Supply
    4 mA
  • Output Type
    Digital
  • Input Type
    Analog
  • Type
    Sensor Interface
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The MCZ33784EFR2 is a specific integrated circuit (IC) chip designed for automotive applications. It is a LIN (Local Interconnect Network) transceiver, which means it enables communication between various electronic control units (ECUs) in a vehicle. Here are some advantages and application scenarios of the MCZ33784EFR2 IC chip:Advantages: 1. LIN Communication: The MCZ33784EFR2 chip supports LIN bus communication, which is widely used in automotive applications for low-speed data exchange between ECUs. It allows for cost-effective and reliable communication within the vehicle.2. High Integration: This IC chip integrates various functionalities required for LIN communication, such as LIN transceiver, voltage regulator, and wake-up functionality. It reduces the need for external components, simplifying the design and reducing the overall system cost.3. Low Power Consumption: The MCZ33784EFR2 chip is designed to operate with low power consumption, making it suitable for automotive applications where power efficiency is crucial. It helps in reducing the overall power consumption of the vehicle's electronic systems.4. Robustness and Reliability: The IC chip is designed to meet the stringent requirements of the automotive industry, including high-temperature operation, electromagnetic compatibility (EMC), and electrostatic discharge (ESD) protection. It ensures reliable and robust communication in harsh automotive environments.Application Scenarios: 1. Automotive Body Control Modules: The MCZ33784EFR2 chip can be used in body control modules (BCMs) to enable communication between various components like door locks, window controls, lighting systems, and other body-related functions.2. Infotainment Systems: In automotive infotainment systems, the MCZ33784EFR2 chip can facilitate communication between different components like audio systems, displays, and control units. It enables data exchange for functions like audio control, display information, and user interface.3. Climate Control Systems: The IC chip can be utilized in climate control systems to enable communication between temperature sensors, HVAC (Heating, Ventilation, and Air Conditioning) controls, and other related components. It allows for efficient control and monitoring of the vehicle's climate control functions.4. Lighting Control Systems: The MCZ33784EFR2 chip can be employed in lighting control systems to enable communication between various lighting components like headlights, taillights, turn signals, and interior lighting. It facilitates control and coordination of lighting functions for safety and convenience.Overall, the MCZ33784EFR2 IC chip offers advantages like LIN communication support, high integration, low power consumption, and robustness, making it suitable for various automotive applications requiring reliable and cost-effective communication between ECUs.
MCZ33784EFR2 Relevant information