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ZSSC3018BA1C

ZSSC3018BA1C

Manufacturer No:

ZSSC3018BA1C

Manufacturer:

Renesas

Description:

DICE (WAFER SAWN) - FRAME

Datasheet:

Datasheet

Delivery:

Payment:

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ZSSC3018BA1C Specifications

  • Type
    Parameter
  • Current - Supply
    1.5 mA
  • Supplier Device Package
    Die
  • Package / Case
    Die
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Output Type
    I²C, Serial, SPI
  • Input Type
    Differential
  • Type
    Signal Conditioner
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
ZSSC3018BA1C Relevant information