73M2901CE-IMR/F
Manufacturer No:
73M2901CE-IMR/F
Manufacturer:
Description:
IC MODEM 3.3V V.22BIS 32-QFN
Datasheet:
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In Stock : 0
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73M2901CE-IMR/F Specifications
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TypeParameter
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Supplier Device Package32-QFN (5x5)
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Package / Case32-VFQFN Exposed Pad
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Mounting TypeSurface Mount
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Voltage - Supply2.7V ~ 3.6V
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Baud Rates300 ~ 9.6k
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Data FormatV.21, V.22, V.23, Bell 103, Bell 212A
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PackagingTape & Reel (TR)
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Product StatusObsolete
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Series-
The 73M2901CE-IMR/F integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips offer high-speed processing capabilities, making them suitable for applications that require quick data processing and response times. 2. Low Power Consumption: The chips are designed to operate efficiently with low power consumption, making them ideal for battery-powered devices or applications where power efficiency is crucial. 3. Versatility: The chips support a wide range of applications, including data acquisition, signal processing, and control systems, making them suitable for various industries and use cases. 4. Compact Size: The chips are compact in size, allowing for easy integration into different electronic devices or systems without occupying much space. 5. Reliability: These chips are designed to be highly reliable, ensuring stable and consistent performance over extended periods.Application Scenarios: 1. Industrial Automation: The chips can be used in industrial automation systems for data acquisition, control, and signal processing tasks. They can help in monitoring and controlling various processes, improving efficiency, and reducing manual intervention. 2. Internet of Things (IoT): With their low power consumption and compact size, these chips are suitable for IoT applications. They can be used in smart home devices, wearable technology, and other IoT devices that require efficient data processing and connectivity. 3. Medical Devices: The chips can be utilized in medical devices such as patient monitoring systems, diagnostic equipment, and medical imaging devices. They can help in processing and analyzing medical data, enabling accurate diagnosis and treatment. 4. Automotive Electronics: These chips can be integrated into automotive systems for tasks like data acquisition, sensor processing, and control. They can be used in applications like engine control units, advanced driver-assistance systems (ADAS), and infotainment systems. 5. Communication Systems: The chips can be employed in communication systems for tasks like signal processing, data compression, and encryption. They can be used in applications such as routers, modems, and network switches.Overall, the 73M2901CE-IMR/F integrated circuit chips offer high performance, low power consumption, and versatility, making them suitable for a wide range of applications in various industries.
73M2901CE-IMR/F Relevant information