PCA9701D,112

PCA9701D,112

Manufacturer No:

PCA9701D,112

Manufacturer:

NXP USA Inc.

Description:

IC XPNDR 5MHZ SPI SERIAL 24SO

Datasheet:

Datasheet

Delivery:

Payment:

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PCA9701D,112 Specifications

  • Type
    Parameter
  • Supplier Device Package
    24-SO
  • Package / Case
    24-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply
    2.5V ~ 5.5V
  • Clock Frequency
    5 MHz
  • Current - Output Source/Sink
    -
  • Output Type
    Push-Pull
  • Features
    -
  • Interrupt Output
    Yes
  • Interface
    SPI Serial
  • Number of I/O
    16 (Input Only)
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The PCA9701D,112 is an integrated circuit chip manufactured by NXP Semiconductors. It is important to note that as an AI language model, my responses are based on general knowledge and may not have access to specific up-to-date information about this particular chip. However, I can provide you with some general information about the advantages and potential application scenarios of integrated circuit chips.Advantages of integrated circuit chips, in general, include:1. Miniaturization: Integrated circuit chips are compact and can contain a large number of electronic components on a single chip, leading to space-saving designs.2. Power efficiency: Integrated circuits are designed to be power-efficient, which is crucial for portable devices and battery-powered applications.3. Cost-effectiveness: Mass production of integrated circuit chips can lead to cost savings due to economies of scale.4. Reliability: Integrated circuits are less prone to failures caused by loose connections or environmental factors, as they are manufactured in a controlled environment.Regarding the specific application scenarios of the PCA9701D,112 chip, it is necessary to refer to the datasheet or technical documentation provided by NXP Semiconductors. These documents typically outline the chip's features, specifications, and recommended applications. By consulting these resources, you can gain a better understanding of the chip's capabilities and potential use cases.