MAX263ACWI+
Manufacturer No:
MAX263ACWI+
Manufacturer:
Description:
IC FILTER BANDPASS PROG 28-SOIC
Datasheet:
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In Stock : 0
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MAX263ACWI+ Specifications
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TypeParameter
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Supplier Device Package28-SOIC
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Package / Case28-SOIC (0.295", 7.50mm Width)
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Mounting TypeSurface Mount
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Voltage - Supply±5V
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Filter Order2nd
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Number of Filters2
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Frequency - Cutoff or Center57kHz
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Filter TypeUniversal Switched Capacitor
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PackagingTube
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PackagingTube
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Product StatusObsolete
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Series-
The MAX263ACWI+ is an integrated circuit chip manufactured by Maxim Integrated. While I don't have access to the specific datasheet for this chip, I can provide you with some general information about integrated circuits and their potential advantages and application scenarios.Advantages of integrated circuit chips, in general, include:1. Miniaturization: Integrated circuits allow for the consolidation of multiple electronic components onto a single chip, resulting in smaller and more compact designs.2. Cost-effectiveness: By integrating multiple components onto a single chip, manufacturing costs can be reduced compared to using individual discrete components.3. Improved performance: Integrated circuits can offer improved performance characteristics, such as faster operation speeds, lower power consumption, and increased reliability.4. Ease of design: Using integrated circuits simplifies the design process, as they provide pre-designed and tested functionality that can be easily incorporated into larger systems.As for the specific application scenarios of the MAX263ACWI+ chip, it would be best to refer to the datasheet or technical documentation provided by Maxim Integrated. The datasheet typically outlines the chip's features, specifications, and recommended applications. It may include information on its intended use in audio, video, communication, or other electronic systems.To obtain accurate and detailed information about the MAX263ACWI+ chip, I recommend consulting the official documentation or reaching out to Maxim Integrated directly for specific application scenarios and further technical details.
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