HSDL-7000
Manufacturer No:
HSDL-7000
Manufacturer:
Description:
IC ENCODER/DECODER 3/16 8SOIC
Datasheet:
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In Stock : 0
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HSDL-7000 Specifications
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TypeParameter
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Supplier Device Package8-SOIC
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Package / Case8-SOIC (0.209", 5.30mm Width)
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Mounting TypeSurface Mount
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Voltage - Supply, Digital2.7V ~ 5.5V
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Voltage - Supply, Analog2.7V ~ 5.5V
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ApplicationsFax, Modems, Pagers
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TypeInfrared Encoder/Decoder
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PackagingTape & Reel (TR)
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Product StatusObsolete
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Series-
The HSDL-7000 integrated circuit chips have several advantages and application scenarios, including:1. High-speed data transfer: The HSDL-7000 chips support high-speed data transfer up to 400Mbps, making them ideal for applications that require fast and reliable data transmission.2. Low power consumption: These chips are designed to consume minimal power, making them suitable for battery-powered devices and energy-efficient applications.3. Broad compatibility: The HSDL-7000 chips are compatible with various communication protocols, such as USB, I2C, SMBus, and UART, enabling seamless integration with different systems and devices.4. Compact size: These chips have a small form factor, allowing for space-saving integration into compact devices like laptops, tablets, and smartphones.5. Automotive applications: The HSDL-7000 chips find extensive use in automotive applications, including infotainment systems, driver-assistance systems, and vehicle diagnostics, due to their high-speed communication capabilities and low power consumption.6. Industrial automation: These chips can be used in industrial automation applications for real-time data transfer between control systems, sensors, and actuators, enabling efficient and reliable communication on the factory floor.7. Consumer electronics: The HSDL-7000 chips can be utilized in various consumer electronic devices, such as gaming consoles, smart TVs, home automation systems, and wearable devices, where high-speed data transfer and low power consumption are essential.8. Medical devices: These chips are well-suited for medical devices that require rapid and secure communication, including patient monitoring systems, medical imaging equipment, and remote healthcare solutions.9. Internet of Things (IoT): The HSDL-7000 chips can be employed in IoT applications, enabling seamless connectivity and data exchange between IoT devices, gateways, and cloud services.In summary, the HSDL-7000 integrated circuit chips offer advantages like high-speed data transfer, low power consumption, compatibility with different communication protocols, and compact size. These chips find application scenarios in automotive, industrial automation, consumer electronics, medical devices, and IoT domains.
HSDL-7000 Relevant information